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UCC2751D

Texas Instruments

UCC2751D by Texas Instruments

UCC2751D by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 12V, it is designed for telecom circuit interfaces.

Median Price

$4.612

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,375 parts In-Stock

1+ parts

-

100+ parts

$3.690

1k+ parts

$3.300

10k+ parts

$3.100

9,375

-

$3.690

$3.300

$3.100

Verical

USA . 9,340 parts In-Stock

1+ parts

-

100+ parts

$4.612

1k+ parts

$4.125

10k+ parts

$3.875

9,340

-

$4.612

$4.125

$3.875

DigiKey

USA . 2,477 parts In-Stock

1+ parts

-

100+ parts

$4.850

1k+ parts

-

10k+ parts

-

2,477

-

$4.850

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,853 parts In-Stock

1+ parts

$3.895

100+ parts

-

1k+ parts

-

10k+ parts

-

4,853

$3.895

-

-

-

Vyrian

USA . 2,692 parts In-Stock

1+ parts

$4.100

100+ parts

-

1k+ parts

-

10k+ parts

-

2,692

$4.100

-

-

-

DigiKey Marketplace

USA . 9,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,375

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,620 parts In-Stock

1+ parts

$3.690

100+ parts

-

1k+ parts

-

10k+ parts

-

4,620

$3.690

-

-

-

Parana Technologies

USA . 169 parts In-Stock

1+ parts

$5.622

100+ parts

-

1k+ parts

$6.419

10k+ parts

-

169

$5.622

-

$6.419

-

DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$6.191

100+ parts

$5.695

1k+ parts

-

10k+ parts

-

770

$6.191

$5.695

-

-

ChromeModa Solutions

Germany . 2,683 parts In-Stock

1+ parts

$6.317

100+ parts

$5.180

1k+ parts

-

10k+ parts

-

2,683

$6.317

$5.180

-

-

IDEA Electronic Components Group

UK . 1,640 parts In-Stock

1+ parts

$6.317

100+ parts

-

1k+ parts

$5.685

10k+ parts

-

1,640

$6.317

-

$5.685

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,933

-

-

-

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Microchip USA

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,850

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-

-

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Kepictronics

USA . 56 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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56

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Overview

Experience the reliability and precision of Texas Instruments with the UCC2751D. This cutting-edge telecom interface IC offers unparalleled quality and performance, making it the ideal choice for a wide range of applications. From telecommunications to industrial settings, this versatile product delivers exceptional value and benefits to customers seeking top-notch solutions. Trust in Texas Instruments to provide you with the innovative technology you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into existing designs.

Power Supplies (V): 12

Operates on a standard power supply voltage of 12V, making it compatible with common power sources.

No. of Terminals: 16

Ample number of terminals allow for multiple connections to other components or devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows for use in both extreme hot and cold environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout.

Maximum Seated Height: 1.75 mm

Low seated height helps in maintaining a compact overall design.

Width: 3.9 mm

Small width enhances the product's versatility in compact electronic devices.

Length: 9.9 mm

Moderate length makes it suitable for a variety of applications without taking up too much space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in harsh industrial environments.

Technology: BICMOS

Utilizes BICMOS technology for a good balance between speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form eases the soldering process during assembly.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, ensuring optimal performance in communication applications.

Nominal Supply Voltage: 12 V

Matches the nominal supply voltage to ensure compatibility with other components in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into circuit board designs.

Technical Specifications

Other Function Telecom Interface ICs UCC2751D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC2751D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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