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UCC2750DWTR

Texas Instruments

UCC2750DWTR by Texas Instruments

UCC2750DWTR by Texas Instruments is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,632 parts In-Stock

1+ parts

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8,632

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Digiode

USA . 3,637 parts In-Stock

1+ parts

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3,637

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 495 parts In-Stock

1+ parts

$5.947

100+ parts

-

1k+ parts

$6.728

10k+ parts

-

495

$5.947

-

$6.728

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$6.548

100+ parts

$6.024

1k+ parts

-

10k+ parts

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1,885

$6.548

$6.024

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ChromeModa Solutions

Germany . 4,237 parts In-Stock

1+ parts

$6.682

100+ parts

$5.479

1k+ parts

-

10k+ parts

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4,237

$6.682

$5.479

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$6.682

100+ parts

-

1k+ parts

$6.014

10k+ parts

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1,748

$6.682

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$6.014

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$7.431

100+ parts

-

1k+ parts

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10k+ parts

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894

$7.431

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One Stop Electronics

USA . 1,402 parts In-Stock

1+ parts

$316.000

100+ parts

-

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10k+ parts

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1,402

$316.000

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Corphita

USA . 3,890 parts In-Stock

1+ parts

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3,890

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Microchip USA

USA . 117 parts In-Stock

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117

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Overview

Unlock the power of seamless communication with the UCC2750DWTR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides seamless connectivity and exceptional performance. Experience the value and benefits of this top-tier technology, designed to enhance your experience and exceed your expectations. Choose Texas Instruments for superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the integrated circuits inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is a standard and efficient design for integration into various electronic devices and systems.

No. of Terminals: 28

Having 28 terminals provides flexibility for connecting to other components and peripherals, allowing for versatile functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact electronic devices and systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Position: DUAL

Dual terminal position offers better stability and connectivity, reducing the risk of signal loss or interference.

Maximum Seated Height: 2.65 mm

Low seated height allows for slim and compact design integration, suitable for space-constrained applications.

Width: 7.5 mm

Optimal width dimension provides a balance between space-saving design and ease of connectivity.

Length: 17.9 mm

Standard length dimension fits well into various electronic devices and systems, ensuring compatibility and versatility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating environments.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections, enhancing the overall durability and performance of the product.

Telecom IC Type: TELECOM CIRCUIT

Specialized telecom circuit type offers efficient and reliable communication functionalities, making it ideal for telecom applications.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch provides a suitable spacing for easy and accurate soldering, ensuring secure connections for optimal performance.

Technical Specifications

Other Function Telecom Interface ICs UCC2750DWTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

UCC2750DWTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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