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UC5607QP

Texas Instruments

UC5607QP by Texas Instruments

UC5607QP by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 3.8-5.25V. It features a BIPOLAR technology, J BEND terminal form, and 110 ohm pull-up resistance. Ideal for SCSI bus termination applications due to its commercial temperature grade and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,857 parts In-Stock

1+ parts

-

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5,857

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Digiode

USA . 1,019 parts In-Stock

1+ parts

-

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1,019

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,245 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,245

$2.500

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Parana Technologies

USA . 1,126 parts In-Stock

1+ parts

$12.035

100+ parts

-

1k+ parts

$12.442

10k+ parts

-

1,126

$12.035

-

$12.442

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DigiPath Technology Company

USA . 886 parts In-Stock

1+ parts

$13.253

100+ parts

$12.192

1k+ parts

-

10k+ parts

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886

$13.253

$12.192

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ChromeModa Solutions

Germany . 3,065 parts In-Stock

1+ parts

$13.523

100+ parts

$11.089

1k+ parts

-

10k+ parts

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3,065

$13.523

$11.089

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IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$13.523

100+ parts

$12.847

1k+ parts

$12.171

10k+ parts

-

1,608

$13.523

$12.847

$12.171

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AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$19.253

100+ parts

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654

$19.253

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Corphita

USA . 4,181 parts In-Stock

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4,181

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Overview

Enhance your data bus systems with the UC5607QP by Texas Instruments. Designed with precision and quality in mind, this chip carrier package offers a reliable solution for SCSI bus terminators. With a wide operating temperature range and low power consumption, this device provides exceptional performance while ensuring seamless connectivity. Trust in Texas Instruments' reputation for excellence and experience the benefits of this versatile and efficient product. Elevate your projects with the UC5607QP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Supply Voltage: 5.25 V

Higher supply voltage allows for more stable operation and better performance.

No. of Terminals: 28

More terminals allow for better connectivity and more options for integration with other components.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the product can withstand demanding conditions without malfunctioning.

Nominal Pull Up Resistance: 110 ohm

Optimal pull-up resistance ensures proper termination of signals and reduces signal reflections.

Interface IC Type: SCSI BUS TERMINATOR

Specific interface IC type ensures compatibility with SCSI bus systems for seamless integration.

Technical Specifications

Data Bus Terminators UC5607QP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

UC5607QP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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