Loading...

UC1706J/80891

Texas Instruments

UC1706J/80891 by Texas Instruments

UC1706J/80891 by Texas Instruments is a MOSFET gate driver with 2 functions, operating at supply voltages b/w 5V to 40V. It features a push-pull based interface IC type and is designed for military-grade applications requiring a nominal output peak current limit of 1A. The package style is in-line with a rectangular shape, making it suitable for various through-hole terminal positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,175

-

-

-

-

Vyrian

USA . 2,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,976

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,348 parts In-Stock

1+ parts

$3.172

100+ parts

-

1k+ parts

$3.693

10k+ parts

-

1,348

$3.172

-

$3.693

-

ChromeModa Solutions

Germany . 6,560 parts In-Stock

1+ parts

$3.564

100+ parts

$2.922

1k+ parts

-

10k+ parts

-

6,560

$3.564

$2.922

-

-

IDEA Electronic Components Group

UK . 1,783 parts In-Stock

1+ parts

$3.564

100+ parts

-

1k+ parts

$3.208

10k+ parts

-

1,783

$3.564

-

$3.208

-

One Stop Electronics

USA . 503 parts In-Stock

1+ parts

$12.500

100+ parts

-

1k+ parts

-

10k+ parts

-

503

$12.500

-

-

-

AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$17.911

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$17.911

-

-

-

DigiPath Technology Company

USA . 670 parts In-Stock

1+ parts

-

100+ parts

$3.213

1k+ parts

-

10k+ parts

-

670

-

$3.213

-

-

Corphita

USA . 554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

554

-

-

-

-

Overview

Enhance your electronic designs with the UC1706J/80891 MOSFET Gate Driver from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and innovative solutions for a wide range of applications. This versatile gate driver offers exceptional performance and efficiency, making it ideal for various projects. With its advanced features and durable construction, this product provides unmatched value and benefits to customers looking to elevate their designs to the next level. Choose Texas Instruments for superior quality and performance in your electronic projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging ensures higher reliability and robustness, making it suitable for harsh environments.

Maximum Supply Voltage: 40 V

Supports a wide range of supply voltages, allowing flexibility in various applications.

No. of Functions: 2

Having two functions in one device saves space on the PCB and simplifies the design.

Screening Level: 38535Q/M;38534H;883B

Compliance with stringent screening levels ensures high quality and reliability of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB and saves space.

Power Supplies (V): 20

Designed to operate effectively with a 20V power supply.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to various other components in the circuit.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into the circuit layout.

Minimum Supply Voltage: 5 V

Can operate effectively at a lower 5V supply voltage, saving power in certain applications.

Maximum Operating Temperature: 125 °C

Supports operation at high temperatures, making it suitable for demanding industrial applications.

Minimum Operating Temperature: -55 °C

Capable of operating in cold environments, ensuring reliability in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting and connectivity options.

Maximum Seated Height: 5.08 mm

Low seated height allows for compact PCB designs.

Width: 7.62 mm

Compact width saves space on the PCB.

Length: 19.56 mm

Optimal length for easy integration into the PCB layout.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliability in extreme operating conditions.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency in driving MOSFETs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are easy to solder onto the PCB.

Nominal Supply Voltage: 20 V

Optimized for a 20V nominal supply voltage for efficient operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy connections and compatibility with standard PCB layouts.

Nominal Output Peak Current Limit: 1 A

Capable of providing a peak output current of 1A, suitable for driving MOSFETs in various applications.

Interface IC Type: PUSH-PULL BASED MOSFET DRIVER

PUSH-PULL based MOSFET driver offers efficient and reliable switching of MOSFETs in the circuit.

Technical Specifications

MOSFET Gate Drivers UC1706J/80891 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Nominal Output Peak Current Limit:

1 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

20

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

20 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

UC1706J/80891 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20