Loading...

IRS21271SPBF

Infineon Technologies

IRS21271SPBF by Infineon Technologies

IRS21271SPBF by Infineon is a MOSFET gate driver with 8 terminals, operating voltage of 10-20V. It has a small outline package, suitable for automotive applications. Features include high side driver, CMOS technology, and fast turn-on/off times of 0.2us.

Median Price

$1.039

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.058

10k+ parts

$0.944

3,775

-

-

$1.058

$0.944

Rochester

USA . 3,775 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

3,775

-

$1.020

$0.847

$0.755

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 41,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41,500

-

-

-

-

Vyrian

USA . 607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

607

-

-

-

-

Digiode

USA . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Pegasus Components GmbH

Germany . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,100 parts In-Stock

1+ parts

$5.021

100+ parts

$4.820

1k+ parts

$4.619

10k+ parts

-

2,100

$5.021

$4.820

$4.619

-

Microchip USA

USA . 942 parts In-Stock

1+ parts

$5.428

100+ parts

-

1k+ parts

-

10k+ parts

-

942

$5.428

-

-

-

Ampacity Inc.

Singapore . 1,606 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,606

$7.500

-

-

-

Corohmni

South Africa . 197 parts In-Stock

1+ parts

$10.515

100+ parts

-

1k+ parts

-

10k+ parts

-

197

$10.515

-

-

-

Advanced Electronics

New Zealand . 67 parts In-Stock

1+ parts

$11.866

100+ parts

$10.798

1k+ parts

$9.730

10k+ parts

-

67

$11.866

$10.798

$9.730

-

Aztec Data Supply Inc.

USA . 3,932 parts In-Stock

1+ parts

$13.698

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

$13.698

-

-

-

AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$16.024

100+ parts

-

1k+ parts

-

10k+ parts

-

698

$16.024

-

-

-

Semicontronic

India . 424 parts In-Stock

1+ parts

$39.500

100+ parts

$38.512

1k+ parts

$38.315

10k+ parts

-

424

$39.500

$38.512

$38.315

-

Continental Prestige Electronics

USA . 4,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,157

-

-

-

-

Glotronic Ltd.

UK . 1,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

-

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Argo Parts USA

USA . 764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

764

-

-

-

-

Corphita

USA . 654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

654

-

-

-

-

Overview

Revolutionize your power management system with the IRS21271SPBF MOSFET Gate Driver by Infineon Technologies. Designed with precision and reliability in mind, this small outline device offers superior performance for a wide range of applications. Whether you're in automotive, industrial, or consumer electronics, this driver provides maximum supply voltage of 20V and turn-on/off times of 0.2 us, ensuring seamless operation in any environment. Elevate your projects with the quality and efficiency that only Infineon can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external elements, ensuring the reliability and longevity of the product.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on circuit boards, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage of 20 V, this product can support a wide range of applications and provide flexibility in voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape offers a convenient form factor for installation and ensures compatibility with standard mounting methods.

Power Supplies (V): 15

Operating with a nominal supply voltage of 15 V, this product is efficient and suitable for various power supply configurations.

No. of Terminals: 8

Having 8 terminals allows for easy connection and integration with other components, simplifying the overall design and assembly process.

Minimum Supply Voltage: 10 V

The minimum supply voltage of 10 V provides a safe operating range and ensures reliable performance even under lower voltage conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures and operate in challenging environments.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish enhances the product's electrical conductivity and corrosion resistance, improving overall performance and reliability.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product has moderate sensitivity to moisture, making it suitable for various environmental conditions and storage requirements.

Technical Specifications

MOSFET Gate Drivers IRS21271SPBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.2 us

Turn-on Time:

.2 us

Width:

3.9 mm

Trade Compliance

IRS21271SPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20