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PUCC21710QDWQ1

Texas Instruments

PUCC21710QDWQ1 by Texas Instruments

Texas Instruments' PUCC21710QDWQ1 is an AEC-Q100 compliant MOSFET gate driver with 16 terminals. Operating temperature ranges from -40°C to 125°C, making it suitable for automotive applications. This rectangular package features a small outline and gull wing terminal form, ideal for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,940 parts In-Stock

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Digiode

USA . 681 parts In-Stock

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681

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Semicontronic

India . 457 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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457

$2.500

$2.438

$2.425

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Corohmni

South Africa . 222 parts In-Stock

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$2.655

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222

$2.655

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Ampacity Inc.

Singapore . 250 parts In-Stock

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$5.500

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250

$5.500

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Parana Technologies

USA . 36 parts In-Stock

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$9.657

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$10.246

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36

$9.657

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$10.246

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$10.348

100+ parts

$9.831

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$9.831

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300

$10.348

$9.831

$9.831

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DigiPath Technology Company

USA . 1,410 parts In-Stock

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$10.634

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1,410

$10.634

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ChromeModa Solutions

Germany . 3,761 parts In-Stock

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$10.851

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$8.898

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3,761

$10.851

$8.898

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$10.851

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$10.308

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$9.766

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791

$10.851

$10.308

$9.766

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AZTECH Wire

Italy . 481 parts In-Stock

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$15.759

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481

$15.759

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One Stop Electronics

USA . 713 parts In-Stock

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$36.500

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713

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Argo Parts USA

USA . 4,833 parts In-Stock

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Corphita

USA . 4,007 parts In-Stock

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Continental Prestige Electronics

USA . 2,233 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance the performance of your automotive applications with the Texas Instruments PUCC21710QDWQ1 MOSFET Gate Driver. Designed with top-quality materials and AEC-Q100 screening level, this small outline package offers reliability and durability in extreme temperature conditions. With a dual terminal position and gull wing form, this buffer or inverter-based driver provides seamless integration for optimal efficiency. Trust Texas Instruments to deliver cutting-edge technology that drives innovation in the automotive industry. Elevate your projects with the PUCC21710QDWQ1 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product resistant to environmental factors such as moisture and temperature changes.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications where reliability is critical.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the board and easy integration with other components in the circuit design.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the device to other components in the circuit, allowing for versatile application usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the board, making it ideal for compact designs or applications with limited space available.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in demanding environments, ensuring stable operation even under extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate effectively in cold environments or during startup conditions without any issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal transmission, minimizing the risk of signal loss or interference in the circuit.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the product can withstand harsh conditions typically found in automotive applications, enhancing its durability and reliability.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, minimizing the risk of signal loss or disconnection during operation.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Buffer or inverter based MOSFET driver provides efficient and precise control over the MOSFET gate, enhancing the performance and reliability of the overall system.

Technical Specifications

MOSFET Gate Drivers PUCC21710QDWQ1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

PUCC21710QDWQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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