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PUCC21750DW

Texas Instruments

PUCC21750DW by Texas Instruments

The Texas Instruments PUCC21750DW is a MOSFET gate driver with 16 terminals, suitable for automotive applications. It operates b/w -40°C to 125°C and features a buffer or inverter-based interface IC type. The package is made of plastic/epoxy, surface mountable, and has a small outline rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,749 parts In-Stock

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2,749

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Digiode

USA . 483 parts In-Stock

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483

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Parana Technologies

USA . 137 parts In-Stock

1+ parts

$1.961

100+ parts

-

1k+ parts

$2.494

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137

$1.961

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$2.494

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DigiPath Technology Company

USA . 1,294 parts In-Stock

1+ parts

$2.159

100+ parts

$1.986

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1,294

$2.159

$1.986

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ChromeModa Solutions

Germany . 6,921 parts In-Stock

1+ parts

$2.203

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$1.806

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6,921

$2.203

$1.806

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IDEA Electronic Components Group

UK . 277 parts In-Stock

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$2.203

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$1.983

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277

$2.203

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$1.983

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Corohmni

South Africa . 249 parts In-Stock

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$2.526

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249

$2.526

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

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$5.500

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1,358

$5.500

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$11.068

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$10.515

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$10.515

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10

$11.068

$10.515

$10.515

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AZTECH Wire

Italy . 888 parts In-Stock

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$18.915

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888

$18.915

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One Stop Electronics

USA . 1,128 parts In-Stock

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$41.500

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1,128

$41.500

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Semicontronic

India . 1,142 parts In-Stock

1+ parts

$49.500

100+ parts

$48.262

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$48.015

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1,142

$49.500

$48.262

$48.015

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Continental Prestige Electronics

USA . 1,936 parts In-Stock

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Argo Parts USA

USA . 1,414 parts In-Stock

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Corphita

USA . 931 parts In-Stock

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931

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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$13.410

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$13.410

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$13.410

350

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$13.410

$13.410

$13.410

Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience unmatched performance and reliability with the Texas Instruments PUCC21750DW MOSFET Gate Driver. Crafted by a leading manufacturer in the industry, this driver is designed to excel in automotive applications, providing seamless operation even in extreme temperatures. Its small outline package and dual terminal position make it versatile and easy to integrate into your project. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and benefits to meet your needs. Drive your success with the PUCC21750DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the circuit board, optimizing the overall design layout.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the device to other components, enhancing compatibility and versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices or designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability under demanding conditions, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in colder environments or start-up conditions, enhancing the product's usability.

Terminal Position: DUAL

Dual terminal position offers more connection options and flexibility in circuit design, making it easier to integrate into different systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the product can withstand the temperature fluctuations and demands of automotive applications, ensuring durability and performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mounting and soldering processes, enhancing the product's ease of installation and reliability.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Buffer or inverter based MOSFET driver interface IC type offers versatility in driving MOSFETs, providing flexibility and compatibility in various circuit designs.

Technical Specifications

MOSFET Gate Drivers PUCC21750DW attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

PUCC21750DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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