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PUCC21220D

Texas Instruments

PUCC21220D by Texas Instruments

PUCC21220D by Texas Instruments is a MOSFET gate driver with a max supply voltage of 5.5V and built-in protections against transients and under voltage. It is commonly used in automotive applications due to its small outline package style and temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,789 parts In-Stock

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4,789

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Digiode

USA . 3,638 parts In-Stock

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3,638

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Nova Conductors

Japan . 43 parts In-Stock

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43

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One Stop Electronics

USA . 1,026 parts In-Stock

1+ parts

$3.500

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1,026

$3.500

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AZTECH Wire

Italy . 893 parts In-Stock

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$6.960

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893

$6.960

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Semicontronic

India . 1,543 parts In-Stock

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$7.500

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$7.312

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$7.275

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1,543

$7.500

$7.312

$7.275

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Parana Technologies

USA . 213 parts In-Stock

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$9.089

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$9.746

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213

$9.089

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$9.746

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DigiPath Technology Company

USA . 1,365 parts In-Stock

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$10.008

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1,365

$10.008

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ChromeModa Solutions

Germany . 5,652 parts In-Stock

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$10.212

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$8.374

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$10.212

$8.374

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IDEA Electronic Components Group

UK . 243 parts In-Stock

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$10.212

100+ parts

$9.701

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$9.191

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243

$10.212

$9.701

$9.191

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Corohmni

South Africa . 260 parts In-Stock

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$14.264

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260

$14.264

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Ampacity Inc.

Singapore . 884 parts In-Stock

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$31.500

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$31.500

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Continental Prestige Electronics

USA . 5,646 parts In-Stock

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Argo Parts USA

USA . 2,093 parts In-Stock

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Corphita

USA . 1,499 parts In-Stock

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1,499

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the superior quality and performance of the PUCC21220D MOSFET Gate Driver by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers cutting-edge solutions that guarantee reliability and innovation. The PUCC21220D is designed to optimize your applications, providing efficient control and protection with its built-in transient and under voltage protections. With its compact package shape and surface mount capability, this gate driver offers convenience and flexibility in various industrial and automotive settings. Trust the PUCC21220D to deliver exceptional value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material enhances its durability and resistance to external elements, ensuring a longer lifespan.

Surface Mount: YES

With the surface mount feature, this product can be easily mounted on PCBs, saving space and making it suitable for compact electronic designs.

Maximum Supply Voltage: 5.5 V

The 5.5 V maximum supply voltage capability ensures compatibility with a wide range of power sources, increasing the versatility of this product.

No. of Functions: 2

Offering two functions in a single device, this product provides added convenience and simplifies circuit integration.

Package Shape: RECTANGULAR

The rectangular package shape enables easy handling and installation, making this product suitable for various applications.

Built-in Protections: TRANSIENT; UNDER VOLTAGE

The built-in transient and under voltage protections provide reliable safeguards against voltage fluctuations and transients, ensuring safe operation of the device.

Maximum Supply Voltage-1: 18 V

With a maximum supply voltage of 18 V, this product can handle higher voltage applications, making it ideal for demanding tasks.

No. of Terminals: 16

The 16-terminal configuration allows for versatile connectivity options and compatibility with complex circuitry, expanding the possibilities for use.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-efficient mounting, making it suitable for applications where size constraints are a concern.

Minimum Supply Voltage-1: 9.2 V

The minimum supply voltage of 9.2 V ensures reliable operation even at lower power input levels, enhancing the device's performance range.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this product can operate efficiently even with limited power sources, making it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product's reliability under demanding thermal conditions, expanding its range of potential applications.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable performance in extreme cold environments, making it suitable for various outdoor or industrial applications.

Terminal Position: DUAL

The dual terminal position allows for flexible connections and easy integration into existing systems or circuits.

Maximum Seated Height: 1.75 mm

With its low maximum seated height, this product can be easily incorporated into compact designs, optimizing space utilization.

Width: 3.9 mm

The compact width of 3.9 mm ensures compatibility with tight PCB spacing, making it suitable for applications with limited board area.

Length: 9.9 mm

The 9.9 mm length provides a compact form factor, allowing for space-efficient installation in various electronic devices or systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the demanding temperature requirements and reliability standards in vehicular environments.

Terminal Form: GULL WING

The gull-wing terminal form simplifies soldering processes and ensures secure connections, facilitating efficient assembly during manufacturing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a stable power source for this product, offering reliable performance in diverse electronic systems.

Terminal Pitch: 1.27 mm

With a small terminal pitch of 1.27 mm, this product is compatible with standard PCB manufacturing processes, allowing for easy integration into various circuit layouts.

Nominal Supply Voltage-1: 12 V

The additional nominal supply voltage of 12 V enhances the compatibility of this product with different power supply options, increasing its versatility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based peripheral driver interface IC type ensures efficient signal transmission and control, enabling seamless integration into complex electronic systems.

Output Current Flow Direction: SOURCE AND SINK

With dual output current flow direction capabilities, this product allows flexibility in managing and controlling current flow, accommodating diverse circuit configurations.

Technical Specifications

MOSFET Gate Drivers PUCC21220D attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

9.2 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

PUCC21220D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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