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TVP3703-170CFN

Texas Instruments

TVP3703-170CFN by Texas Instruments

TVP3703-170CFN by Texas Instruments is a display controller with 1600x1280 pixels. It operates at 4.75-5.25V, -40 to 70°C, and has an 8-bit external data bus width. Ideal for commercial applications requiring high-resolution displays in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,970 parts In-Stock

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4,970

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Digiode

USA . 2,204 parts In-Stock

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2,204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,539 parts In-Stock

1+ parts

$3.000

100+ parts

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1,539

$3.000

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$18.391

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445

$18.391

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Parana Technologies

USA . 431 parts In-Stock

1+ parts

$54.958

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431

$54.958

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Corohmni

South Africa . 413 parts In-Stock

1+ parts

$57.162

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413

$57.162

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ChromeModa Solutions

Germany . 4,446 parts In-Stock

1+ parts

$61.751

100+ parts

$50.636

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4,446

$61.751

$50.636

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IDEA Electronic Components Group

UK . 83 parts In-Stock

1+ parts

$61.751

100+ parts

$58.663

1k+ parts

$55.576

10k+ parts

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83

$61.751

$58.663

$55.576

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DigiPath Technology Company

USA . 2,109 parts In-Stock

1+ parts

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$55.675

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2,109

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$55.675

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Corphita

USA . 1,018 parts In-Stock

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1,018

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Overview

Experience crystal clear visuals like never before with the TVP3703-170CFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This display controller offers unparalleled performance in various applications, providing customers with a seamless viewing experience. Upgrade your display system today with the TVP3703-170CFN and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility and compatibility with a wider range of power sources.

Address Bus Width: 3

A wider address bus width allows for more data processing capabilities and faster performance.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the circuit board.

No. of Terminals: 68

Higher number of terminals allows for more connections and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and easy handling of the display controller.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures energy efficiency and compatibility with a variety of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability and performance in various environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder conditions.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections on the circuit board.

Display Config: 1600 X 1280 PIXELS

High display resolution of 1600 x 1280 pixels provides crisp and detailed images on the screen.

Maximum Seated Height: 4.57 mm

Low maximum seated height allows for a compact and slim design of the display controller.

Width: 24.2316 mm

Optimal width ensures efficient use of space on the circuit board.

External Data Bus Width: 8

Wider external data bus width allows for faster data transfer and improved performance.

Length: 24.2316 mm

Optimal length ensures compactness and efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability and performance in standard operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Peripheral IC type includes display controller and palette DAC for comprehensive display control capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high integration for efficient operation.

Terminal Form: J BEND

J bend terminal form allows for easy and secure connections on the circuit board.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5 V for compatibility with common power sources.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for precise connections on the circuit board.

Technical Specifications

Display Controllers TVP3703-170CFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.2316 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

TVP3703-170CFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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