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TVP3409-135FN

Texas Instruments

TVP3409-135FN by Texas Instruments

TVP3409-135FN by Texas Instruments is a display controller with 1024x768 pixels, 8-bit data bus, and 14.318 MHz clock frequency. It is used in commercial applications for driving displays with a max supply voltage of 5.25V and operating temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,326 parts In-Stock

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4,326

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Vyrian

USA . 2,497 parts In-Stock

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2,497

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$9.158

100+ parts

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872

$9.158

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One Stop Electronics

USA . 565 parts In-Stock

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$30.000

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565

$30.000

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Corohmni

South Africa . 3,016 parts In-Stock

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$37.032

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3,016

$37.032

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Parana Technologies

USA . 1,491 parts In-Stock

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$69.849

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1,491

$69.849

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DigiPath Technology Company

USA . 101 parts In-Stock

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$76.912

100+ parts

$70.759

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101

$76.912

$70.759

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ChromeModa Solutions

Germany . 2,693 parts In-Stock

1+ parts

$78.482

100+ parts

$64.355

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2,693

$78.482

$64.355

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IDEA Electronic Components Group

UK . 504 parts In-Stock

1+ parts

$78.482

100+ parts

$74.558

1k+ parts

$70.634

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504

$78.482

$74.558

$70.634

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Corphita

USA . 3,668 parts In-Stock

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3,668

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Overview

Elevate your display experience with the TVP3409-135FN by Texas Instruments. Crafted with precision and quality, this display controller offers unmatched performance and reliability. Ideal for a variety of applications, this product delivers seamless integration and smooth operation. Unlock the full potential of your display systems with the advanced features and innovative design of the TVP3409-135FN. Experience the difference that Texas Instruments brings to the table and elevate your visual experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, improving the overall efficiency of the product.

Maximum Supply Voltage: 5.25 V

With a higher maximum supply voltage, the product can handle higher power requirements, providing more flexibility in terms of power sources.

Address Bus Width: 2

A wider address bus width allows for efficient data transfer and communication between components, enhancing the overall performance of the product.

Package Shape: SQUARE

Square package shape ensures a compact design, saving space and allowing for easy integration into a system or device.

No. of Terminals: 68

Having a higher number of terminals allows for more connections and functionalities, making the product versatile and capable of handling complex tasks.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and protection for the internal components, ensuring reliability and longevity of the product.

Minimum Supply Voltage: 4.75 V

Having a lower minimum supply voltage ensures operational stability even under low power conditions, making the product reliable in various operating environments.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand heat and operate efficiently in demanding conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the product's reliability in cold environments, making it suitable for various applications.

Terminal Position: QUAD

Quad terminal position allows for easy connections and maintenance, simplifying the installation process and improving the overall user experience.

Display Config: 1024 X 768 PIXELS

High display resolution offers sharp and clear visuals, providing an excellent viewing experience for users.

Maximum Seated Height: 4.57 mm

Low seated height saves space and allows for a thinner design, making the product suitable for compact devices and applications.

Width: 24.23 mm

Compact width ensures the product can fit into tight spaces and be easily integrated into various systems or devices.

External Data Bus Width: 8

With a wider external data bus width, the product can handle larger data transfers, improving overall performance and speed.

Maximum Clock Frequency: 14.318 MHz

Higher clock frequency allows for faster data processing and communication, enhancing the product's performance and efficiency.

Length: 24.23 mm

Compact length ensures the product's overall size is small, making it suitable for applications where space is limited.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product meets industry standards and can operate reliably in typical commercial environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Having a display controller and palette DAC as peripheral IC types enables the product to efficiently manage and enhance the image quality of displays.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the product energy-efficient and suitable for various applications.

Terminal Form: J BEND

J bend terminal form provides secure connections and ensures stability, reducing the risk of disconnection or malfunction in the product.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product, meeting the standard voltage requirements.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product allows for dense packing of components, saving space and enabling high-performance applications.

Technical Specifications

Display Controllers TVP3409-135FN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

2

Maximum Clock Frequency:

14.318 MHz

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TVP3409-135FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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