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LC74789M

Onsemi

LC74789M by Onsemi

LC74789M by Onsemi is a display controller with 24 terminals, operating b/w -30 °C to 70°C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its small outline package and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,821 parts In-Stock

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Digiode

USA . 817 parts In-Stock

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817

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TANS Electronics

Latvia . 6,869 parts In-Stock

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6,869

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Problanco Electronics

Mexico . 4,027 parts In-Stock

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Corphita

USA . 1,960 parts In-Stock

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1,960

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Kulean Microsystems

USA . 836 parts In-Stock

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836

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UHIMA Technologies

Türkiye . 292 parts In-Stock

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SupplyDigital Components

Austria . 126 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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Overview

Enhance your display systems with the LC74789M by Onsemi, a top-notch display controller that guarantees superior performance and reliability. Onsemi is renowned for its high-quality products, and this one is no exception. Perfect for a wide range of applications, this product offers unmatched value and benefits, ensuring seamless operation and enhanced user experience. Upgrade your displays today with the LC74789M and see the difference it can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and is lightweight, making the product durable and easy to handle.

Surface Mount: YES

Surface mount technology reduces the size of the product and allows for higher density mounting on PCBs, leading to space-saving benefits.

Package Shape: RECTANGULAR

The rectangular shape is a common and versatile form factor, making it easier to integrate the display controller into various electronic devices.

Power Supplies (V): 5

Operating at 5V makes this product compatible with standard power sources, ensuring easy integration into different systems.

No. of Terminals: 24

Having a sufficient number of terminals allows for multiple connections and functionalities, enhancing the versatility of the display controller.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on the PCB and enables compact designs for electronic products.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: -30 °C

The ability to function at low temperatures down to -30 °C makes this display controller suitable for a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connections and enable different configurations to accommodate diverse system requirements.

Peripheral IC Type: GRAPHICS PROCESSOR

Featuring a graphics processor as the peripheral IC type enhances the visual performance and capabilities of the display controller, making it suitable for demanding graphics applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, enhancing the efficiency and reliability of the display controller.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure connections and reliable performance of the display controller.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the integration of the display controller into various electronic systems.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact connections on the PCB, enabling high-density mounting and space-saving benefits in electronic designs.

Technical Specifications

Display Controllers LC74789M attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74789M Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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