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TVP3026-175MHFGB

Texas Instruments

TVP3026-175MHFGB by Texas Instruments

TVP3026-175MHFGB by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit external data bus width, and 14.31818 MHz clock frequency. Ideal for military applications due to its MIL temperature grade and CMOS technology, it features a ceramic-metal sealed co-fired package with 164 terminals in a square shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,960 parts In-Stock

1+ parts

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4,960

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Digiode

USA . 1,245 parts In-Stock

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1,245

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$8.736

100+ parts

-

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228

$8.736

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One Stop Electronics

USA . 504 parts In-Stock

1+ parts

$26.000

100+ parts

-

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504

$26.000

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Corohmni

South Africa . 1,130 parts In-Stock

1+ parts

$55.323

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1,130

$55.323

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Parana Technologies

USA . 1,851 parts In-Stock

1+ parts

$67.160

100+ parts

$6,236.852

1k+ parts

$60.444

10k+ parts

-

1,851

$67.160

$6,236.852

$60.444

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DigiPath Technology Company

USA . 1,373 parts In-Stock

1+ parts

$73.952

100+ parts

-

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1,373

$73.952

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ChromeModa Solutions

Germany . 5,199 parts In-Stock

1+ parts

$75.461

100+ parts

$61.878

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5,199

$75.461

$61.878

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IDEA Electronic Components Group

UK . 2,296 parts In-Stock

1+ parts

$75.461

100+ parts

$71.688

1k+ parts

$67.915

10k+ parts

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2,296

$75.461

$71.688

$67.915

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Corphita

USA . 4,323 parts In-Stock

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4,323

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Overview

Elevate your display controller experience with the TVP3026-175MHFGB by Texas Instruments. Manufactured with precision and quality, this product offers unparalleled performance and reliability in a wide range of applications. Designed to deliver exceptional value and benefits to customers, this display controller boasts advanced features and capabilities that set it apart from the rest. Trust Texas Instruments for cutting-edge technology and superior engineering in every product, making the TVP3026-175MHFGB a top choice for all your display control needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability in various operating conditions.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with a wide range of systems.

Display Config: 1600 X 1280 PIXELS

The high display resolution of 1600 x 1280 pixels provides sharp and detailed image quality for enhanced viewing experience.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency enables fast data processing and smooth performance of the display controller.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance in harsh environmental conditions, making it suitable for demanding applications.

Technical Specifications

Display Controllers TVP3026-175MHFGB attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CQFP-F164

Length:

25.4 mm

No. of Terminals:

164

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.01 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25.4 mm

Peripheral IC Type:

Trade Compliance

TVP3026-175MHFGB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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