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TVP3025-170PCE

Texas Instruments

TVP3025-170PCE by Texas Instruments

TVP3025-170PCE by Texas Instruments is a display controller with 1600x1280 pixels, CMOS technology, and 8-bit external data bus width. It operates b/w 0 to 70°C and has a terminal pitch of 0.65mm. Ideal for commercial applications requiring high-resolution displays in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,237 parts In-Stock

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3,237

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Digiode

USA . 2,881 parts In-Stock

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2,881

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,427 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,427

$1.000

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AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$7.971

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729

$7.971

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Parana Technologies

USA . 397 parts In-Stock

1+ parts

$15.806

100+ parts

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$16.167

10k+ parts

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397

$15.806

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$16.167

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DigiPath Technology Company

USA . 1,493 parts In-Stock

1+ parts

$17.405

100+ parts

$16.012

1k+ parts

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1,493

$17.405

$16.012

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ChromeModa Solutions

Germany . 2,003 parts In-Stock

1+ parts

$17.760

100+ parts

$14.563

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2,003

$17.760

$14.563

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IDEA Electronic Components Group

UK . 1,613 parts In-Stock

1+ parts

$17.760

100+ parts

$16.872

1k+ parts

$15.984

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1,613

$17.760

$16.872

$15.984

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Corohmni

South Africa . 2,483 parts In-Stock

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$67.444

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2,483

$67.444

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Corphita

USA . 1,917 parts In-Stock

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1,917

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Overview

Enhance your display performance with the TVP3025-170PCE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality display controllers that cater to a wide range of applications. The TVP3025-170PCE offers unparalleled value with its advanced features and benefits, providing customers with a seamless viewing experience. Upgrade your display systems with this cutting-edge product and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Maximum Supply Voltage: 5.25 V

This product can handle a relatively high voltage supply, making it versatile and suitable for various applications.

Address Bus Width: 5

With a wide address bus width of 5, this display controller can efficiently handle and process data, leading to faster performance.

Display Config: 1600 X 1280 PIXELS

The high resolution display configuration of 1600 x 1280 pixels ensures clear and detailed visuals, making it ideal for high-quality display applications.

External Data Bus Width: 8

The wide external data bus width of 8 allows for fast and efficient data transfer between the controller and the display, resulting in smooth and seamless performance.

Technology: CMOS

Built using CMOS technology, this display controller offers low power consumption, high noise immunity, and faster switching speeds, making it a reliable and efficient choice.

Technical Specifications

Display Controllers TVP3025-170PCE attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

5

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G160

Length:

28 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TVP3025-170PCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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