Loading...

TSC2005IYZLR

Texas Instruments

TSC2005IYZLR by Texas Instruments

TSC2005IYZLR by Texas Instruments is a telecom interface IC with 28 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for industrial telecom circuits due to its very thin profile and fine pitch design.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,495 parts In-Stock

1+ parts

$2.840

100+ parts

$2.489

1k+ parts

$1.406

10k+ parts

-

19,495

$2.840

$2.489

$1.406

-

Rochester

USA . 9,180 parts In-Stock

1+ parts

-

100+ parts

$2.330

1k+ parts

$2.080

10k+ parts

$1.960

9,180

-

$2.330

$2.080

$1.960

DigiKey

USA . 9,180 parts In-Stock

1+ parts

-

100+ parts

$3.060

1k+ parts

-

10k+ parts

-

9,180

-

$3.060

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.600

10k+ parts

$2.450

6,000

-

-

$2.600

$2.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,692 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

-

10k+ parts

-

2,692

$1.852

-

-

-

Vyrian

USA . 3,406 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

-

3,406

$1.950

-

-

-

DigiKey Marketplace

USA . 9,180 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

-

10k+ parts

-

9,180

-

$2.140

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,042 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

-

10,042

$1.660

-

-

-

Corphita

USA . 1,633 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$1.755

-

-

-

Vigor

Singapore . 9,180 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

10k+ parts

-

9,180

$2.090

-

-

-

Component Stockers USA

USA . 10,914 parts In-Stock

1+ parts

$2.120

100+ parts

$1.990

1k+ parts

$1.790

10k+ parts

-

10,914

$2.120

$1.990

$1.790

-

Parana Technologies

USA . 1,464 parts In-Stock

1+ parts

$9.875

100+ parts

-

1k+ parts

$10.446

10k+ parts

-

1,464

$9.875

-

$10.446

-

DigiPath Technology Company

USA . 1,488 parts In-Stock

1+ parts

$10.874

100+ parts

$10.004

1k+ parts

-

10k+ parts

-

1,488

$10.874

$10.004

-

-

IDEA Electronic Components Group

UK . 276 parts In-Stock

1+ parts

$11.096

100+ parts

$10.541

1k+ parts

$9.986

10k+ parts

-

276

$11.096

$10.541

$9.986

-

ChromeModa Solutions

Germany . 43 parts In-Stock

1+ parts

$11.096

100+ parts

$9.099

1k+ parts

-

10k+ parts

-

43

$11.096

$9.099

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,758

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,957

-

-

-

-

Kepictronics

USA . 4,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,142

-

-

-

-

Assy Fe

Spain . 4,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,142

-

-

-

-

Metaverse IC Inc.

Canada . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Overview

Elevate your telecom interface systems with the TSC2005IYZLR by Texas Instruments. Crafted with precision and expertise, this versatile IC offers unparalleled performance and reliability. From grid arrays to fine-pitch packages, this product is designed to excel in a variety of applications. Experience seamless connectivity and enhanced functionality with the TSC2005IYZLR, providing value and efficiency that goes beyond expectations. Trust Texas Instruments to deliver cutting-edge solutions for all your telecom interface needs.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Provides a standardized shape for easy integration into various electronic systems.

No. of Terminals: 28

Offers a sufficient number of terminals for connecting multiple components.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can also function in extremely cold conditions, ensuring versatility in different environments.

Terminal Finish: TIN SILVER COPPER

Provides a durable and reliable finish for long-term use.

Terminal Position: BOTTOM

Facilitates easy placement on PCBs for efficient assembly.

Maximum Seated Height: 0.625 mm

Low profile design allows for compact and space-saving circuit layouts.

Width: 2.75 mm

Narrow width enables efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow soldering without the risk of overheating.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes.

Length: 3.25 mm

Compact length contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings with varying temperature conditions.

Terminal Form: BALL

Ball terminals offer secure connections and easy soldering.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density mounting, maximizing board space usage.

Technical Specifications

Other Function Telecom Interface ICs TSC2005IYZLR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Length:

3.25 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.75 mm

Trade Compliance

TSC2005IYZLR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 13