Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TSC2200IPWR by Texas Instruments is a telecom interface IC with 1 function. It has a small outline, thin profile package style and operates at temperatures ranging from -40 to 85 °C. It is commonly used in telecom circuits for single-ended input applications.
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Futuretech Components
This product's package body material of plastic/epoxy provides durability and resistance to external factors, making it a reliable choice.
Featuring surface mount capability, this product allows for easy and efficient installation, enhancing its usability and convenience.
With one function, this product simplifies the design and implementation process, making it a cost-effective and straightforward choice.
The rectangular package shape of this product is space-efficient and compatible with various applications, making it versatile and suitable for different design requirements.
Providing 28 terminals, this product offers connectivity options and flexibility in connecting external devices, allowing for expanded functionality and design possibilities.
The small outline, thin profile, and shrink pitch package style of this product enable space-saving and compact designs, making it ideal for applications with limited space constraints.
With a maximum operating temperature of 85°C, this product ensures stable and reliable performance even in high-temperature environments, offering reliability and versatility.
The minimum operating temperature of -40°C further showcases the product's ability to perform effectively in a wide range of temperature conditions, making it suitable for various applications.
Featuring a terminal finish of nickel palladium gold, this product offers excellent conductivity, corrosion resistance, and long-term reliability, making it a high-quality and durable choice.
The dual terminal position of this product facilitates easy connection and compatibility with different systems, enhancing its versatility and usability.
With a maximum seated height of 1.2 mm, this product offers a compact and low-profile design, allowing for seamless integration and space optimization in various applications.
The width dimension of 4.4 mm makes this product compact and space-efficient, making it suitable for designs with limited available space.
With a maximum time at peak reflow temperature of 30 seconds, this product ensures reliable soldering and efficient manufacturing processes, contributing to its ease of use and reliability.
The peak reflow temperature of 260°C provides optimal soldering conditions, ensuring strong and durable connections, enhancing the overall performance and durability of the product.
The length dimension of 9.7 mm offers compactness and compatibility with different design requirements, allowing for versatile and flexible application possibilities.
This product's temperature grade of industrial indicates its ability to withstand harsh operating conditions, making it suitable for demanding industrial applications, ensuring reliability and longevity.
With a gull wing terminal form, this product provides secure and reliable soldering connections, contributing to its long-term functionality and robustness.
Being a telecom circuit type IC, this product is specifically designed to meet the requirements and demands of telecommunications applications, ensuring seamless communication and compatibility.
With a nominal supply voltage of 2.7 V, this product offers compatibility with various power sources, making it suitable for diverse applications with different power requirements.
The terminal pitch of 0.65 mm allows for precise and secure connections, enhancing the overall reliability and performance of the product.
Featuring a moisture sensitivity level of 1, this product exhibits strong resistance to moisture and humidity, ensuring long-term reliability and performance in various environments.
With a single-ended input type, this product simplifies signal routing and processing, making it easier to integrate into different systems and enhancing its versatility.
Other Function Telecom Interface ICs TSC2200IPWR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments
Input Type:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
TSC2200IPWR Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Design 22/Feb/2022
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
1N4148W-7-F
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
TCA6424ARGJR
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
LM555CMX
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
LM2675M-ADJ/NOPB
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Itt Semiconductor
261
Deltrol Controls
Other Relays;
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
Philips Components
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
SX1302IMLTRT
Semtech
TELECOM CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
TSC2000IPWG4
TSC2000IPWG4 by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, GULL WING terminal form, and SINGLE-ENDED input type. Ideal for telecom circuits in industrial applications due to its compact size and high reliability.
SN65LVCP114ZJA
SN65LVCP114ZJA by Texas Instruments is a telecom interface IC with 4 functions, operating at 2.5/3.3V. It features a grid array package style with 167 terminals and supports data rates up to 14200 Mbps. Ideal for industrial applications requiring high-speed communication in harsh environments.
ATPL250A-AKU-R
Microchip Technology
ATPL250A-AKU-R by Microchip Technology is a telecom interface IC with 1 function. It has a square package shape, 80 terminals, and a low profile flatpack style. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications in the telecom circuit field.
CC1190RGVT
CC1190RGVT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for industrial applications requiring a compact design and reliable performance.
CC2640R2FYFVR
CC2640R2FYFVR by Texas Instruments is a telecom IC with 34 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it has a very thin profile and fine pitch design for compact applications.
451-00001
Laird Technologies
Laird Technologies' 451-00001 is a telecom IC with 71 terminals, operating at -40 to 85°C. With a supply voltage of 3.3V, it supports data rates up to 2 Mbps. This surface-mount IC in rectangular package is ideal for telecom circuit applications.
ESP32-WROVER-B
Espressif Systems (shanghai)
ESP32-WROVER-B by Espressif Systems is a telecom IC with 38 terminals, operating at -40 to 85°C. It has a data rate of 150 Mbps and runs on a nominal voltage of 3.3V. Ideal for applications requiring high-speed wireless connectivity in compact devices.
MD0100N8-G
MD0100N8-G by Microchip Tech is a telecom IC with 3 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. The package is small outline, low profile, with matte tin finish and single terminal position.
BMD-360-A-R
U-blox Ag
BMD-360-A-R by U-blox Ag is a surface mount telecom IC with 47 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a data rate of 2 Mbps, it is suitable for various telecom circuit applications.
MFRC63003HNE
NXP Semiconductors
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
SPBTLE-RFTR
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
450-0162C
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ISP1507-AX-ST
Insight Sip
ISP1507-AX-ST by Insight Sip is a telecom IC with 2 Mbps data rate, operating at -40 to 85°C. It features a square package, 62 terminals, and is surface mountable. Ideal for industrial applications requiring a 3V supply voltage in microelectronic assemblies.
AS3933-BTST
Ams Ag
AS3933-BTST by Ams Ag is a telecom IC with 16 terminals, operating from -40 to 85°C. It features a small outline package, Gull Wing terminals, and 3V supply voltage. Ideal for telecom circuits, this IC has a rectangular shape and is surface mountable for industrial applications.
F2480NBGI
Renesas Electronics
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: Tin (Sn);
BT832AF
Fanstel
BT832AF by Fanstel is a telecom IC with 1 Mbps data rate, suitable for industrial applications. It features a rectangular microelectronic assembly package style, surface mount design, and operates b/w -40 to 85°C temperatures. With 40 terminals and compact dimensions of 14mm width and 20.8mm length, it offers versatile connectivity options in telecom interfaces.
M2-MAYA-W166-10C
TELECOM CIRCUIT;
TLK2711AIRCPR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HVFQFP; Package Shape: SQUARE;
Supertex
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TSC2000IPW
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
TSC2000IPWR
TSC2000IPWR by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, single-ended input type, and nominal voltage of 2.7V. Ideal for telecom circuits due to its compact size and industrial temperature grade suitability.
TSC2000IPWRG4
TSC2000IPWRG4 by Texas Instruments is a Telecom Interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, single-ended input type, and nominal voltage of 2.7V for telecom circuit applications.
TSC2200IRHB
TSC2200IRHB by Texas Instruments is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a supply voltage of 2.7V, it features single-ended input and nickel palladium gold terminal finish, ideal for telecom circuit applications.
TSC2005IYZLR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
TSC2005IYZLT
TSC2200IPW
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
TSC2200IPWG4
TSC2200IPWRG4
TSC2200IRHBG4
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TSC2200IRHBR
TSC2200IRHBRG4
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