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TSC2200IPWR

Texas Instruments

TSC2200IPWR by Texas Instruments

TSC2200IPWR by Texas Instruments is a telecom interface IC with 1 function. It has a small outline, thin profile package style and operates at temperatures ranging from -40 to 85 °C. It is commonly used in telecom circuits for single-ended input applications.

Median Price

$5.262

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,479 parts In-Stock

1+ parts

$5.262

100+ parts

$4.290

1k+ parts

$2.860

10k+ parts

-

44,479

$5.262

$4.290

$2.860

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$3.010

-

-

-

Digiode

USA . 1,369 parts In-Stock

1+ parts

$4.999

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

$4.999

-

-

-

Chip Stock

USA . 4,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,595

-

-

-

-

Vyrian

USA . 2,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,373

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

$2.859

10k+ parts

$2.799

1,000

$3.010

-

$2.859

$2.799

Ampacity Inc.

Singapore . 44,035 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

-

10k+ parts

-

44,035

$4.470

-

-

-

Corphita

USA . 629 parts In-Stock

1+ parts

$4.736

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$4.736

-

-

-

AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$11.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,082

$11.370

-

-

-

Parana Technologies

USA . 2,343 parts In-Stock

1+ parts

$11.889

100+ parts

-

1k+ parts

$12.285

10k+ parts

-

2,343

$11.889

-

$12.285

-

DigiPath Technology Company

USA . 2,125 parts In-Stock

1+ parts

$13.091

100+ parts

-

1k+ parts

-

10k+ parts

-

2,125

$13.091

-

-

-

IDEA Electronic Components Group

UK . 1,143 parts In-Stock

1+ parts

$13.358

100+ parts

$12.690

1k+ parts

$12.022

10k+ parts

-

1,143

$13.358

$12.690

$12.022

-

ChromeModa Solutions

Germany . 981 parts In-Stock

1+ parts

$13.358

100+ parts

$10.954

1k+ parts

-

10k+ parts

-

981

$13.358

$10.954

-

-

Lixinc

USA . 16,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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16,407

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

-

Futuretech Components

Singapore . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,980

-

-

-

-

Overview

Experience the next level of quality and performance with the TSC2200IPWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge telecom interface ICs that are built to last. The TSC2200IPWR offers a wide range of applications in the telecom sector, providing seamless connectivity and enhanced functionality. With its small outline, thin profile package style, and shrink pitch, this product is designed for easy installation and space-saving solutions. Experience the value, benefits, and advantages that the TSC2200IPWR offers, and unlock a world of endless possibilities in the telecom industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material of plastic/epoxy provides durability and resistance to external factors, making it a reliable choice.

Surface Mount: YES

Featuring surface mount capability, this product allows for easy and efficient installation, enhancing its usability and convenience.

No. of Functions: 1

With one function, this product simplifies the design and implementation process, making it a cost-effective and straightforward choice.

Package Shape: RECTANGULAR

The rectangular package shape of this product is space-efficient and compatible with various applications, making it versatile and suitable for different design requirements.

No. of Terminals: 28

Providing 28 terminals, this product offers connectivity options and flexibility in connecting external devices, allowing for expanded functionality and design possibilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product enable space-saving and compact designs, making it ideal for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product ensures stable and reliable performance even in high-temperature environments, offering reliability and versatility.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C further showcases the product's ability to perform effectively in a wide range of temperature conditions, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Featuring a terminal finish of nickel palladium gold, this product offers excellent conductivity, corrosion resistance, and long-term reliability, making it a high-quality and durable choice.

Terminal Position: DUAL

The dual terminal position of this product facilitates easy connection and compatibility with different systems, enhancing its versatility and usability.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product offers a compact and low-profile design, allowing for seamless integration and space optimization in various applications.

Width: 4.4 mm

The width dimension of 4.4 mm makes this product compact and space-efficient, making it suitable for designs with limited available space.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product ensures reliable soldering and efficient manufacturing processes, contributing to its ease of use and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C provides optimal soldering conditions, ensuring strong and durable connections, enhancing the overall performance and durability of the product.

Length: 9.7 mm

The length dimension of 9.7 mm offers compactness and compatibility with different design requirements, allowing for versatile and flexible application possibilities.

Temperature Grade: INDUSTRIAL

This product's temperature grade of industrial indicates its ability to withstand harsh operating conditions, making it suitable for demanding industrial applications, ensuring reliability and longevity.

Terminal Form: GULL WING

With a gull wing terminal form, this product provides secure and reliable soldering connections, contributing to its long-term functionality and robustness.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed to meet the requirements and demands of telecommunications applications, ensuring seamless communication and compatibility.

Nominal Supply Voltage: 2.7 V

With a nominal supply voltage of 2.7 V, this product offers compatibility with various power sources, making it suitable for diverse applications with different power requirements.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and secure connections, enhancing the overall reliability and performance of the product.

Moisture Sensitivity Level (MSL): 1

Featuring a moisture sensitivity level of 1, this product exhibits strong resistance to moisture and humidity, ensuring long-term reliability and performance in various environments.

Input Type: SINGLE-ENDED

With a single-ended input type, this product simplifies signal routing and processing, making it easier to integrate into different systems and enhancing its versatility.

Technical Specifications

Other Function Telecom Interface ICs TSC2200IPWR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Input Type:

SINGLE-ENDED

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TSC2200IPWR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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