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TSC2200IPWG4

Texas Instruments

TSC2200IPWG4 by Texas Instruments

TSC2200IPWG4 by Texas Instruments is a Telecom Interface IC with 28 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish and 2.7V supply voltage for telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,812 parts In-Stock

1+ parts

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5,812

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Digiode

USA . 2,416 parts In-Stock

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2,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$11.734

100+ parts

-

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619

$11.734

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Parana Technologies

USA . 1,396 parts In-Stock

1+ parts

$14.675

100+ parts

-

1k+ parts

$15.115

10k+ parts

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1,396

$14.675

-

$15.115

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Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$15.292

100+ parts

$13.916

1k+ parts

$12.539

10k+ parts

-

95

$15.292

$13.916

$12.539

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DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

$16.159

100+ parts

$14.866

1k+ parts

-

10k+ parts

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2,371

$16.159

$14.866

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$16.489

100+ parts

$15.665

1k+ parts

$14.840

10k+ parts

-

2,369

$16.489

$15.665

$14.840

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ChromeModa Solutions

Germany . 1,706 parts In-Stock

1+ parts

$16.489

100+ parts

$13.521

1k+ parts

-

10k+ parts

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1,706

$16.489

$13.521

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One Stop Electronics

USA . 1,221 parts In-Stock

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$421.000

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1,221

$421.000

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Corphita

USA . 832 parts In-Stock

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832

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Overview

Unlock the power of seamless communication with the TSC2200IPWG4 by Texas Instruments. As a leader in innovative technology, Texas Instruments ensures top-notch quality and reliability in all its products. The TSC2200IPWG4 falls under the category of Other Function Telecom Interface ICs, making it a versatile solution for various telecom applications. Experience the value of superior performance and efficiency with this product, offering customers unparalleled benefits and advantages. Choose Texas Instruments for cutting-edge solutions that elevate your communication experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the product is robust and long-lasting, making it suitable for reliable telecom applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 28

Having a high number of terminals provides flexibility in connectivity options and allows for a variety of functions to be supported.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliability in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Width: 4.4 mm

The compact width of the package allows for efficient use of space on the circuit board, ideal for space-constrained designs.

Length: 9.7 mm

The moderate length provides a balance between compactness and functionality, suitable for various telecom applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage is compatible with common power sources, making integration into existing systems easier.

Technical Specifications

Other Function Telecom Interface ICs TSC2200IPWG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TSC2200IPWG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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