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TSC2200IRHBRG4

Texas Instruments

TSC2200IRHBRG4 by Texas Instruments

TSC2200IRHBRG4 by Texas Instruments is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.7V, it is designed for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,826 parts In-Stock

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4,826

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Vyrian

USA . 3,438 parts In-Stock

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3,438

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Distributors (Availability)

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AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$4.942

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430

$4.942

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Parana Technologies

USA . 768 parts In-Stock

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$8.924

100+ parts

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$9.596

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768

$8.924

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$9.596

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DigiPath Technology Company

USA . 2,187 parts In-Stock

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$9.826

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2,187

$9.826

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ChromeModa Solutions

Germany . 3,998 parts In-Stock

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$10.027

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$8.222

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3,998

$10.027

$8.222

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IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$10.027

100+ parts

$9.526

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$9.024

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2,079

$10.027

$9.526

$9.024

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Semicontronic

India . 1,236 parts In-Stock

1+ parts

$91.000

100+ parts

$88.725

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$88.270

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1,236

$91.000

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$88.270

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One Stop Electronics

USA . 621 parts In-Stock

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$138.000

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621

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Ampacity Inc.

Singapore . 197 parts In-Stock

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$588.000

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197

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Corphita

USA . 439 parts In-Stock

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Corohmni

South Africa . 275 parts In-Stock

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Overview

Elevate your telecom interface systems with the TSC2200IRHBRG4 by Texas Instruments. With a reputation for superior quality and innovation, Texas Instruments offers cutting-edge solutions for various industries. This product falls under the category of Other Function Telecom Interface ICs, providing seamless connectivity and enhanced performance. The TSC2200IRHBRG4 boasts a multitude of advantages, including a wide operating temperature range, high reliability, and compact design. Elevate your projects with this top-of-the-line product that delivers unmatched value and benefits to customers. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, ideal for compact designs.

No. of Terminals: 32

With 32 terminals, this IC offers a wide range of connectivity options, enabling versatile functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style, along with heat sink/slug and very thin profile design, ensures efficient heat dissipation and compact integration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the IC to perform reliably under various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the IC can function in a wide range of temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent solderability and corrosion resistance, enhancing the IC's lifespan.

Terminal Position: QUAD

The quad terminal position enables easy PCB layout and connection, simplifying the overall circuit design.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for slim and compact device designs.

Width: 5 mm

The compact width of 5mm makes this IC suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature of 30 seconds helps prevent overheating and potential damage during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and overall durability.

Length: 5 mm

The compact length of 5mm further enhances the IC's compatibility with compact designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this IC suitable for rugged and demanding environments.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and promotes eco-friendly practices.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is optimized for telecommunication applications, ensuring reliable data transmission and communication.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7V is commonly used in telecom applications, providing compatibility with existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and connectivity, ideal for compact PCB layouts.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this IC is less susceptible to moisture-related damage, ensuring reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs TSC2200IRHBRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TSC2200IRHBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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