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TSC2200IPWRG4

Texas Instruments

TSC2200IPWRG4 by Texas Instruments

TSC2200IPWRG4 by Texas Instruments is a Telecom Interface IC with 28 terminals, operating b/w -40 to 85°C. It features a small outline package style and single-ended input type, suitable for telecom circuits. The IC has a nominal voltage of 2.7V and terminal finish of Ni/Pd/Au for industrial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,473 parts In-Stock

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Vyrian

USA . 4,443 parts In-Stock

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Chip Stock

USA . 1,077 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 677 parts In-Stock

1+ parts

$8.599

100+ parts

-

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$9.261

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677

$8.599

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$9.261

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DigiPath Technology Company

USA . 1,100 parts In-Stock

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$9.469

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$8.711

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$9.469

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ChromeModa Solutions

Germany . 1,196 parts In-Stock

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$9.662

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$7.923

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$9.662

$7.923

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IDEA Electronic Components Group

UK . 395 parts In-Stock

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$9.662

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$9.179

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$8.696

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395

$9.662

$9.179

$8.696

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AZTECH Wire

Italy . 493 parts In-Stock

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$14.629

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493

$14.629

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$16.939

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$15.414

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$13.890

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$16.939

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$13.890

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Semicontronic

India . 1,273 parts In-Stock

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$702.000

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$684.450

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$680.940

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Ampacity Inc.

Singapore . 737 parts In-Stock

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$761.000

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737

$761.000

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One Stop Electronics

USA . 301 parts In-Stock

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$864.000

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Lixinc

USA . 15,522 parts In-Stock

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Corphita

USA . 4,693 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 2,048 parts In-Stock

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Corohmni

South Africa . 412 parts In-Stock

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Kepictronics

USA . 168 parts In-Stock

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Overview

Elevate your telecom interface applications with the TSC2200IPWRG4 by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this small outline, thin profile IC offers customers unmatched performance and reliability. With its dual terminal position and industrial temperature grade, this Telecom Circuit IC is perfect for a wide range of functions. Experience seamless integration, improved efficiency, and enhanced connectivity with the TSC2200IPWRG4. Upgrade your systems today and discover the difference that Texas Instruments can make in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling the product to interface with a range of other devices or components.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can function effectively in a wide range of environmental conditions, enhancing overall reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures that the product remains functional even in extremely cold environments, making it suitable for various applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V allows the product to operate efficiently while consuming minimal power, promoting energy efficiency in the system.

Technical Specifications

Other Function Telecom Interface ICs TSC2200IPWRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Input Type:

SINGLE-ENDED

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TSC2200IPWRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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