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TPS1100Y

Texas Instruments

TPS1100Y by Texas Instruments

TPS1100Y by Texas Instruments is a P-CHANNEL FET for switching applications. It features a 15V DS breakdown voltage, operates in enhancement mode, and has a max temp of 150°C. This single transistor with built-in diode comes in a rectangular package style suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,859 parts In-Stock

1+ parts

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8,859

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Digiode

USA . 4,693 parts In-Stock

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4,693

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Distributors (Availability)

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Parana Technologies

USA . 1,393 parts In-Stock

1+ parts

$1.488

100+ parts

-

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$2.162

10k+ parts

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1,393

$1.488

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$2.162

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DigiPath Technology Company

USA . 2,295 parts In-Stock

1+ parts

$1.639

100+ parts

$1.507

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2,295

$1.639

$1.507

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ChromeModa Solutions

Germany . 6,465 parts In-Stock

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$1.672

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$1.371

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6,465

$1.672

$1.371

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$1.672

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$1.505

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681

$1.672

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$1.505

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AZTECH Wire

Italy . 359 parts In-Stock

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$13.824

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359

$13.824

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Ampacity Inc.

Singapore . 877 parts In-Stock

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$38.050

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877

$38.050

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Semicontronic

India . 394 parts In-Stock

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$51.050

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$49.774

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$49.518

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394

$51.050

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$49.518

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One Stop Electronics

USA . 358 parts In-Stock

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$56.050

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358

$56.050

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Corphita

USA . 4,346 parts In-Stock

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Corohmni

South Africa . 258 parts In-Stock

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Overview

Unleash the power of advanced technology with the TPS1100Y by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-quality products that exceed industry standards. The TPS1100Y is a game-changer in the field of Small Signal Field Effect Transistors, offering a single configuration with a built-in diode for seamless switching applications. With its P-Channel polarity and enhancement mode operation, this transistor provides unmatched performance and reliability. Trust Texas Instruments to deliver cutting-edge solutions for your electronic needs, and experience the difference with the TPS1100Y.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors are well-suited for applications where low power consumption and high efficiency are desired.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can save space on the PCB.

Transistor Application: SWITCHING

Switching transistors are designed to quickly turn on and off, making them ideal for digital circuits and power management.

Surface Mount: YES

Surface mount packaging allows for easy and efficient automated assembly of electronic circuits.

Minimum DS Breakdown Voltage: 15 V

With a breakdown voltage of 15V, this transistor can handle moderate voltages without malfunctioning.

Package Shape: RECTANGULAR

Rectangular packages are common and easy to handle during production and installation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high input impedance and low output impedance, making them suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon transistors are commonly used due to their reliability, high performance, and compatibility with existing manufacturing processes.

Terminal Position: UPPER

The upper terminal position can facilitate easier routing of connections in a circuit layout.

Technical Specifications

Small Signal Field Effect Transistors (FET) TPS1100Y attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, ESD PROTECTED

Minimum DS Breakdown Voltage:

15 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUUC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TPS1100Y Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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