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TPS1101PWRG4

Texas Instruments

TPS1101PWRG4 by Texas Instruments

TPS1101PWRG4 by Texas Instruments is a P-CHANNEL FET with 15V DS Breakdown Voltage and 2.18A Drain Current. Ideal for SWITCHING applications, it features ENHANCEMENT MODE operation, GULL WING terminals, and a max operating temperature of 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,672 parts In-Stock

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3,672

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Digiode

USA . 1,847 parts In-Stock

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1,847

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Distributors (Availability)

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Parana Technologies

USA . 2,078 parts In-Stock

1+ parts

$0.850

100+ parts

-

1k+ parts

$1.805

10k+ parts

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2,078

$0.850

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$1.805

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DigiPath Technology Company

USA . 914 parts In-Stock

1+ parts

$0.936

100+ parts

$0.861

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-

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914

$0.936

$0.861

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ChromeModa Solutions

Germany . 5,985 parts In-Stock

1+ parts

$0.955

100+ parts

$0.783

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-

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5,985

$0.955

$0.783

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IDEA Electronic Components Group

UK . 2,082 parts In-Stock

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$0.955

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$0.860

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2,082

$0.955

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$0.860

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Semicontronic

India . 155 parts In-Stock

1+ parts

$1.050

100+ parts

$1.024

1k+ parts

$1.018

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155

$1.050

$1.024

$1.018

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$1.796

100+ parts

$1.634

1k+ parts

$1.473

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1,000

$1.796

$1.634

$1.473

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Ampacity Inc.

Singapore . 882 parts In-Stock

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$3.050

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882

$3.050

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AZTECH Wire

Italy . 487 parts In-Stock

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$14.386

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487

$14.386

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One Stop Electronics

USA . 1,192 parts In-Stock

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$41.050

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1,192

$41.050

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Corphita

USA . 1,008 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Overview

Enhance your electronic devices with the TPS1101PWRG4 from Texas Instruments, a high-quality P-channel small signal field-effect transistor designed for switching applications. With a single configuration and built-in diode, this transistor offers optimal performance and reliability. Its compact package body material and surface mount capability make it ideal for space-constrained designs. Trust in Texas Instruments' reputation for excellence in semiconductor technology and bring efficiency and precision to your projects with the TPS1101PWRG4. Upgrade your devices today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the transistor lightweight and durable, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for easy integration into circuits and enables efficient switching functions.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide protection against reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast and reliable performance in controlling electrical signals.

Minimum DS Breakdown Voltage: 15 V

The high breakdown voltage allows for safe operation in various voltage environments.

Surface Mount: YES

The surface mount capability enables easy and compact PCB assembly.

Maximum Drain Current (Abs) (ID): 2.18 A

With a high maximum drain current, this transistor can handle demanding current loads.

Maximum Power Dissipation (Abs): 0.71 W

The low power dissipation ensures efficient operation and helps prevent overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for reliable performance in various environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high switching speeds and low power consumption.

Technical Specifications

Small Signal Field Effect Transistors (FET) TPS1101PWRG4 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, ESD PROTECTED

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

15 V

Maximum Drain Current (Abs) (ID):

2.18 A

Maximum Drain Current (ID):

2.18 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

16

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TPS1101PWRG4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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