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FQT1N60CTF-WS

Onsemi

FQT1N60CTF-WS by Onsemi

FQT1N60CTF-WS by Onsemi is a N-channel FET with 600V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, Gull Wing terminal form, and 2.1W max power dissipation. Suitable for enhancement mode operation at up to 150°C, it has a drain-source on resistance of 11.5 ohm and max drain current of 0.2A.

Median Price

$0.296

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 17,351 parts In-Stock

1+ parts

$1.090

100+ parts

$0.445

1k+ parts

$0.316

10k+ parts

$0.240

17,351

$1.090

$0.445

$0.316

$0.240

Arrow

USA . 8,000 parts In-Stock

1+ parts

-

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$0.236

8,000

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$0.236

Verical

USA . 8,000 parts In-Stock

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$0.237

8,000

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$0.237

Chip1Stop

Japan . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.354

1k+ parts

$0.278

10k+ parts

$0.258

4,000

-

$0.354

$0.278

$0.258

Distributors (In-Stock)

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Nova Conductors

Japan . 350 parts In-Stock

1+ parts

$0.312

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350

$0.312

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Digiode

USA . 1,804 parts In-Stock

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$0.922

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1,804

$0.922

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DF Sales Co.

USA . 80 parts In-Stock

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$1.250

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80

$1.250

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DF Sales Co.

USA . 80 parts In-Stock

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$1.250

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80

$1.250

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Flip Electronics

USA . 64,148 parts In-Stock

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Chip Stock

USA . 13,986 parts In-Stock

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NAC Semi

USA . 12,000 parts In-Stock

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$0.345

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Vyrian

USA . 10,162 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,109 parts In-Stock

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Bristol Electronics

USA . 338 parts In-Stock

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338

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Flex Direct, LLC

USA . 338 parts In-Stock

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338

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SPM Sales

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 20,394 parts In-Stock

1+ parts

$0.190

100+ parts

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20,394

$0.190

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Semicontronic

India . 27,432 parts In-Stock

1+ parts

$0.201

100+ parts

$0.196

1k+ parts

$0.195

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27,432

$0.201

$0.196

$0.195

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Decca Corp

Germany . 8,339 parts In-Stock

1+ parts

$0.201

100+ parts

$0.197

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$0.195

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8,339

$0.201

$0.197

$0.195

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Continental Prestige Electronics

USA . 7,371 parts In-Stock

1+ parts

$0.302

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$0.296

7,371

$0.302

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$0.296

Argo Parts USA

USA . 6,422 parts In-Stock

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$0.302

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$0.293

6,422

$0.302

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$0.293

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.306

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$0.294

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2,000

$0.306

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$0.294

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.312

100+ parts

$0.306

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100

$0.312

$0.306

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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$0.420

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120

$0.420

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Corohmni

South Africa . 540 parts In-Stock

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$0.430

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540

$0.430

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Component Stockers USA

USA . 23,160 parts In-Stock

1+ parts

$0.730

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$0.430

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$0.310

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$0.230

23,160

$0.730

$0.430

$0.310

$0.230

Corphita

USA . 1,220 parts In-Stock

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$0.873

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$0.873

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Advanced Electronics

New Zealand . 2,700 parts In-Stock

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$1.726

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$1.640

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$1.640

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$1.726

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$1.640

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Perfect Parts

USA . 36,045 parts In-Stock

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iodParts Technologies Inc.

India . 10,331 parts In-Stock

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Kulean Microsystems

USA . 8,187 parts In-Stock

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TANS Electronics

Latvia . 6,918 parts In-Stock

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Problanco Electronics

Mexico . 5,857 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,788 parts In-Stock

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SupplyDigital Components

Austria . 5,329 parts In-Stock

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Kepictronics

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Lixinc

USA . 3,076 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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Overview

Looking for a reliable small signal field effect transistor (FET) for your switching applications? Look no further than the FQT1N60CTF-WS by Onsemi. With a minimum DS breakdown voltage of 600V and maximum power dissipation of 2.1W, this N-channel transistor offers enhanced performance and durability. Its single configuration with a built-in diode makes it a versatile choice for various electronic projects. Trust Onsemi's expertise in semiconductor technology to deliver top-quality components that meet your needs. Upgrade your designs with the FQT1N60CTF-WS and experience the difference in efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of electrons in the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by having a diode integrated within the transistor package.

Transistor Application: SWITCHING

Ideal for applications where rapid on/off switching is required.

Surface Mount: YES

Facilitates easy and convenient mounting on PCBs.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance, making it suitable for various applications.

Maximum Drain Current (Abs) (ID): 0.2 A

Can handle up to 0.2 A of current, suitable for low-power applications.

Maximum Power Dissipation (Abs): 2.1 W

Can dissipate up to 2.1 W of power, ensuring reliable operation.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures without performance degradation.

Maximum Drain-Source On Resistance: 11.5 ohm

Low resistance ensures efficient power transfer in the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) FQT1N60CTF-WS attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.2 A

Maximum Drain Current (ID):

.2 A

Maximum Drain-Source On Resistance:

11.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6 pF

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQT1N60CTF-WS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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