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FQT13N06LTF

Onsemi

FQT13N06LTF by Onsemi

FQT13N06LTF by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a max drain current of 2.8A and 0.14 ohm drain-source on resistance. With a small outline package style and matte tin terminal finish, it operates at up to 150°C temperature.

Median Price

$0.468

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 942 parts In-Stock

1+ parts

$0.285

100+ parts

$0.268

1k+ parts

$0.242

10k+ parts

-

942

$0.285

$0.268

$0.242

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Newark

USA . 1,741 parts In-Stock

1+ parts

$0.650

100+ parts

$0.329

1k+ parts

$0.254

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1,741

$0.650

$0.329

$0.254

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Distributors (In-Stock)

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Digiode

USA . 1,104 parts In-Stock

1+ parts

$0.271

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-

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1,104

$0.271

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Nova Conductors

Japan . 91 parts In-Stock

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$0.327

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91

$0.327

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Sensible Micro Corp

USA . 16,000 parts In-Stock

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Chip Stock

USA . 15,500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,930 parts In-Stock

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5,930

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Rebound Electronics

UK . 3,204 parts In-Stock

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3,204

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J2 Sourcing AB

Sweden . 1,648 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,494 parts In-Stock

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1,494

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Whistler Technology

UK . 1,000 parts In-Stock

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Component Sense

UK . 842 parts In-Stock

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Vyrian

USA . 732 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$0.179

100+ parts

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1

$0.179

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Semicontronic

India . 603 parts In-Stock

1+ parts

$0.242

100+ parts

$0.236

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$0.235

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603

$0.242

$0.236

$0.235

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Ampacity Inc.

Singapore . 519 parts In-Stock

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$0.242

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519

$0.242

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Corphita

USA . 3,386 parts In-Stock

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$0.256

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3,386

$0.256

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Corohmni

South Africa . 472 parts In-Stock

1+ parts

$0.285

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472

$0.285

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Argo Parts USA

USA . 2,556 parts In-Stock

1+ parts

$0.338

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$0.327

2,556

$0.338

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-

$0.327

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

$0.321

10k+ parts

$0.314

100

$0.338

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$0.321

$0.314

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.392

100+ parts

$0.360

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$0.338

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20

$0.392

$0.360

$0.338

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Aztec Data Supply Inc.

USA . 862 parts In-Stock

1+ parts

$0.920

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862

$0.920

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AZTECH Wire

Italy . 763 parts In-Stock

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$6.171

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763

$6.171

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RC Electronics

USA . 90,195 parts In-Stock

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Perfect Parts

USA . 31,711 parts In-Stock

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Lixinc

USA . 19,559 parts In-Stock

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Futuretech Components

Singapore . 7,500 parts In-Stock

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Problanco Electronics

Mexico . 6,647 parts In-Stock

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Kulean Microsystems

USA . 6,067 parts In-Stock

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SupplyDigital Components

Austria . 5,428 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 5,113 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,496 parts In-Stock

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TANS Electronics

Latvia . 2,298 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Supply Digital

USA . 846 parts In-Stock

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UHIMA Technologies

Türkiye . 740 parts In-Stock

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740

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Overview

Unleash the power of cutting-edge technology with the FQT13N06LTF by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor offers unparalleled performance in switching applications. With a maximum DS Breakdown Voltage of 60V and a Maximum Drain Current of 2.8A, this N-CHANNEL transistor is designed to exceed expectations. Its robust construction and reliable operation make it a valuable asset for any project. Whether you're a seasoned professional or a DIY enthusiast, the FQT13N06LTF delivers unrivaled quality and efficiency, setting a new standard in the field of electronic components. Elevate your creations with Onsemi's exceptional FET technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components from external elements, making the transistor suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher mobility and faster switching speeds, making this transistor ideal for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and adds versatility to the transistor's functionality, enabling it to be used in a wider range of circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle rapid changes in voltage and current, making it reliable for tasks that require frequent on/off cycles.

Surface Mount: YES

Being surface mountable means easy and efficient installation on PCBs, saving space and improving overall circuit board layout.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can withstand higher voltage levels, providing a margin of safety in circuits where voltage spikes may occur.

Maximum Drain Current (Abs) (ID): 2.8 A

Capable of handling high current loads, this transistor is suitable for applications that require power amplification or switching of moderate to high currents.

Maximum Power Dissipation (Abs): 2.1 W

The high power dissipation rating indicates the transistor's ability to handle heat, ensuring reliable operation even under demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high switching speeds and low power consumption, making the transistor energy efficient and suitable for battery-powered electronics.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can reliably function in elevated temperature environments without performance degradation.

Technical Specifications

Small Signal Field Effect Transistors (FET) FQT13N06LTF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.8 A

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

23 pF

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQT13N06LTF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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