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TNETE2201APJD

Texas Instruments

TNETE2201APJD by Texas Instruments

TNETE2201APJD by Texas Instruments is an Ethernet transceiver with 1250 Mbps data rate, operating at 3.3V. It features a flatpack package style, quad terminal position, and Gull Wing terminal form. Ideal for network interfaces in commercial-grade applications due to its compact size and low power consumption of 0.26 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,763 parts In-Stock

1+ parts

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1k+ parts

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3,763

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Digiode

USA . 2,286 parts In-Stock

1+ parts

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2,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$8.050

100+ parts

-

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774

$8.050

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Parana Technologies

USA . 292 parts In-Stock

1+ parts

$14.674

100+ parts

-

1k+ parts

$15.115

10k+ parts

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292

$14.674

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$15.115

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ChromeModa Solutions

Germany . 6,800 parts In-Stock

1+ parts

$16.488

100+ parts

$13.520

1k+ parts

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6,800

$16.488

$13.520

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$16.488

100+ parts

$15.664

1k+ parts

$14.839

10k+ parts

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359

$16.488

$15.664

$14.839

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One Stop Electronics

USA . 928 parts In-Stock

1+ parts

$458.000

100+ parts

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928

$458.000

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Corphita

USA . 885 parts In-Stock

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885

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

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100+ parts

$14.866

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608

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$14.866

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Overview

Unlock the power of seamless networking with the TNETE2201APJD by Texas Instruments. Renowned for their high-quality products, Texas Instruments leads the industry in network interfaces, ensuring reliability and performance. From Ethernet transceivers to advanced connectivity solutions, this device offers unparalleled value to customers seeking fast and efficient data transmission. Perfect for a wide range of applications, choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection, making this product suitable for long-term use in various environments.

Surface Mount: YES

Being surface mountable makes installation of this network interface easier and more convenient, especially in compact and crowded spaces.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs, contributing to a sleek and organized layout.

Power Supplies (V): 3.3

Operating at 3.3 volts ensures optimal performance and energy efficiency, making this network interface a cost-effective and reliable solution.

No. of Terminals: 64

With a high number of terminals, this network interface can accommodate a wide range of connections and functions, enhancing its versatility and compatibility.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70°C ensures stability and reliability even in demanding conditions, making this product suitable for industrial use.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this network interface can function effectively in various environments, ensuring consistent performance in both cold and hot conditions.

Terminal Position: QUAD

The quad terminal position enables efficient routing of connections and signals, promoting easy installation and maintenance of the network interface.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm allows for a compact and streamlined design, making this network interface ideal for space-constrained applications.

Width: 10 mm

With a width of 10 mm, this network interface is compact and space-saving, enabling seamless integration into circuit layouts and designs.

Length: 10 mm

Measuring 10 mm in length, this network interface is compact and easy to handle, making installation and maintenance hassle-free and efficient.

Temperature Grade: COMMERCIAL

Designed for commercial use, this network interface meets industry standards for performance and reliability, making it a trusted and dependable choice for various applications.

Technology: CMOS

Utilizing CMOS technology ensures high-speed data processing and low power consumption, enhancing the efficiency and performance of this network interface.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring reliable operation and durability in the network interface.

Maximum Supply Current: 0.26 mA

Operating at a maximum supply current of 0.26 mA, this network interface offers energy efficiency and low power consumption, contributing to cost savings and sustainability.

Telecom IC Type: ETHERNET TRANSCEIVER

Designed as an Ethernet transceiver, this network interface facilitates high-speed data transmission and networking capabilities, making it ideal for communication and connectivity needs.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 volts, this network interface ensures stable and reliable performance, supporting consistent operation and functionality.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and secure connections, promoting efficient signal transmission and reducing the risk of signal interference or loss.

Data Rate: 1250 Mbps

Capable of handling data rates of up to 1250 Mbps, this network interface supports high-speed data transfer and communication, making it suitable for demanding network applications.

Technical Specifications

Network Interfaces TNETE2201APJD attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TNETE2201APJD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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