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TNETE211PNR

Texas Instruments

TNETE211PNR by Texas Instruments

TNETE211PNR by Texas Instruments is a CMOS network interface IC with 80 terminals in a square package. It operates b/w 0-70°C, suitable for commercial use at 5V supply voltage. With gull wing terminal form and 0.5mm pitch, it's ideal for telecom interface circuits requiring low profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,774 parts In-Stock

1+ parts

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6,774

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Digiode

USA . 3,086 parts In-Stock

1+ parts

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3,086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 919 parts In-Stock

1+ parts

$10.118

100+ parts

-

1k+ parts

$10.664

10k+ parts

-

919

$10.118

-

$10.664

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DigiPath Technology Company

USA . 2,224 parts In-Stock

1+ parts

$11.141

100+ parts

$10.249

1k+ parts

-

10k+ parts

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2,224

$11.141

$10.249

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ChromeModa Solutions

Germany . 4,579 parts In-Stock

1+ parts

$11.368

100+ parts

$9.322

1k+ parts

-

10k+ parts

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4,579

$11.368

$9.322

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$11.368

100+ parts

$10.800

1k+ parts

$10.231

10k+ parts

-

182

$11.368

$10.800

$10.231

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$17.570

100+ parts

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258

$17.570

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One Stop Electronics

USA . 1,529 parts In-Stock

1+ parts

$86.000

100+ parts

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1,529

$86.000

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Corphita

USA . 4,659 parts In-Stock

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4,659

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Overview

Get connected with the TNETE211PNR by Texas Instruments, a top-of-the-line network interface designed for seamless communication. Crafted with precision and expertise by Texas Instruments, this device offers unparalleled quality and reliability. Whether you're in need of high-speed data transfers or efficient networking solutions, the TNETE211PNR is your go-to choice. With its cutting-edge technology and user-friendly design, this product ensures smooth operation and optimal performance. Elevate your connectivity experience with the TNETE211PNR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protects the internal components of the network interface.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board.

No. of Terminals: 80

With 80 terminals, this network interface can support multiple connections, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These features make the network interface suitable for high-density applications and ensure optimal signal transmission.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the network interface can withstand a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C ensures reliability in various working environments.

Terminal Position: QUAD

Quad terminal position allows for secure connections and efficient signal transmission.

Maximum Seated Height: 1.6 mm

Low maximum seated height helps in achieving a sleek and compact design for the network interface.

Width: 12 mm

With a width of 12 mm, the network interface can be easily integrated into different electronic devices and systems.

Length: 12 mm

Compact length of 12 mm further enhances the versatility and flexibility of the network interface in various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the network interface energy-efficient and effective.

Terminal Form: GULL WING

Gull wing terminal form provides stability and durability to the connection points, ensuring reliable signal transmission.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, this network interface offers tailored functionality and performance.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5V, making it compatible with standard power sources and systems.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this network interface allows for precise and compact connections, ideal for high-density circuit designs.

Technical Specifications

Network Interfaces TNETE211PNR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TNETE211PNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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