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TNETE2101APZ

Texas Instruments

TNETE2101APZ by Texas Instruments

TNETE2101APZ by Texas Instruments is an Ethernet transceiver IC with 100 terminals in a square package. It operates at 3.3V, utilizing CMOS technology with GULL WING terminal form. Ideal for network interfaces, it features a low profile flatpack design suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,011

-

-

-

-

Digiode

USA . 3,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,801

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 287 parts In-Stock

1+ parts

$10.775

100+ parts

$1,000.644

1k+ parts

$9.698

10k+ parts

-

287

$10.775

$1,000.644

$9.698

-

DigiPath Technology Company

USA . 2,224 parts In-Stock

1+ parts

$11.865

100+ parts

$10.916

1k+ parts

-

10k+ parts

-

2,224

$11.865

$10.916

-

-

ChromeModa Solutions

Germany . 4,184 parts In-Stock

1+ parts

$12.107

100+ parts

$9.928

1k+ parts

-

10k+ parts

-

4,184

$12.107

$9.928

-

-

IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$12.107

100+ parts

$11.502

1k+ parts

$10.896

10k+ parts

-

1,076

$12.107

$11.502

$10.896

-

AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$19.765

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$19.765

-

-

-

One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$477.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,128

$477.000

-

-

-

Corphita

USA . 3,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,383

-

-

-

-

Overview

Experience unparalleled connectivity with the TNETE2101APZ from Texas Instruments. As a leading manufacturer in network interfaces, Texas Instruments delivers top-quality products that cater to a wide range of applications. With its compact design and advanced technology, this Ethernet transceiver offers seamless integration and reliable performance. Stay ahead of the curve and elevate your networking capabilities with the TNETE2101APZ - your gateway to enhanced connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the network interface lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it suitable for compact electronic devices.

No. of Terminals: 100

With a high number of terminals, this network interface can support multiple connections and functions, enhancing its versatility in networking applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables a compact design, suitable for high-density circuit board layouts and space-constrained applications.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection to the PCB, ensuring reliable performance and durability in networking systems.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim profile, making this network interface suitable for thin electronic devices and applications where space is limited.

Width: 14 mm

The 14mm width offers a compact form factor, allowing for efficient integration into various electronic systems while conserving space on the PCB.

Length: 14 mm

With a length of 14mm, this network interface is suitable for applications requiring a small footprint, making it ideal for compact electronic devices.

Technology: CMOS

Utilizing CMOS technology enables efficient power consumption and high-speed operation, making this network interface energy-efficient and reliable for networking needs.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability during installation and operation, ensuring a secure connection for long-lasting performance.

Telecom IC Type: ETHERNET TRANSCEIVER

Designed as an Ethernet transceiver, this network interface can support high-speed data transmission and communication over Ethernet networks, making it suitable for networking applications requiring fast and reliable connectivity.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this network interface is compatible with standard voltage levels in electronic systems, providing seamless integration and reliable performance.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this network interface allows for precise and compact connections on the PCB, enabling efficient signal routing and high-density circuit board layouts.

Technical Specifications

Network Interfaces TNETE2101APZ attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TNETE2101APZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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