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TNETE2201BPJWRG4

Texas Instruments

TNETE2201BPJWRG4 by Texas Instruments

TNETE2201BPJWRG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1250 Mbps, operating at 3.3V. It features a quad-terminal position, Gull Wing terminal form, and CMOS technology. Ideal for network interfaces in commercial-grade applications due to its compact square package design and low supply current of 0.26 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 7,800 parts In-Stock

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Vyrian

USA . 6,119 parts In-Stock

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Digiode

USA . 1,750 parts In-Stock

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1,750

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Nova Conductors

Japan . 900 parts In-Stock

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900

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AZTECH Wire

Italy . 384 parts In-Stock

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$8.655

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384

$8.655

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Parana Technologies

USA . 2,113 parts In-Stock

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$9.535

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$10.133

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DigiPath Technology Company

USA . 2,184 parts In-Stock

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$10.499

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

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$10.713

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$10.177

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$9.642

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ChromeModa Solutions

Germany . 277 parts In-Stock

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$10.713

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$8.785

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Component Stockers USA

USA . 782 parts In-Stock

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$99.990

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One Stop Electronics

USA . 1,481 parts In-Stock

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$128.000

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Ampacity Inc.

Singapore . 951 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,505 parts In-Stock

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Continental Prestige Electronics

USA . 3,004 parts In-Stock

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Corphita

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Argo Parts USA

USA . 1,084 parts In-Stock

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Microchip USA

USA . 945 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 99 parts In-Stock

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Overview

Elevate your network connections with the TNETE2201BPJWRG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality network interfaces. This innovative product offers unparalleled reliability and seamless performance, making it perfect for a wide range of applications. Whether you're upgrading your home network or enhancing your business operations, this Ethernet transceiver ensures fast data rates of up to 1250 Mbps, all while maintaining a low supply current and commercial-grade temperature tolerance. Experience the superior value and benefits that Texas Instruments brings to the table with the TNETE2201BPJWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for easy handling and long-term usage.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making the assembly process more efficient.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard power sources, making it easy to integrate this product into existing setups.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing for versatile usage and connection to multiple devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature environments, ensuring reliability and performance in various conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C ensures usability in colder environments, making this product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish ensures excellent conductivity and corrosion resistance, enhancing the product's overall reliability and longevity.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for a slim and compact design, enabling easy integration into tight spaces or devices with space constraints.

Data Rate: 1250 Mbps

With a high data rate of 1250 Mbps, this product is capable of handling large amounts of data quickly and efficiently, making it suitable for high-speed networking applications.

Technical Specifications

Network Interfaces TNETE2201BPJWRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TNETE2201BPJWRG4 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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