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TNETE2201BPHDG4

Texas Instruments

TNETE2201BPHDG4 by Texas Instruments

TNETE2201BPHDG4 by Texas Instruments is an Ethernet transceiver with 1250 Mbps data rate, operating at 3.3V. It features a quad-terminal position, Gull Wing terminal form, and CMOS technology. Ideal for network interfaces in commercial-grade applications due to its compact square package design and low supply current of 0.26 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,489 parts In-Stock

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Digiode

USA . 3,721 parts In-Stock

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Euro-Tech

UK . 85 parts In-Stock

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85

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Distributors (Availability)

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AZTECH Wire

Italy . 713 parts In-Stock

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$7.233

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713

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Parana Technologies

USA . 1,370 parts In-Stock

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$14.195

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$14.650

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1,370

$14.195

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$14.650

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DigiPath Technology Company

USA . 604 parts In-Stock

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$15.630

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$14.380

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604

$15.630

$14.380

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ChromeModa Solutions

Germany . 6,120 parts In-Stock

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$15.949

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$13.078

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$15.949

$13.078

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IDEA Electronic Components Group

UK . 269 parts In-Stock

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$15.949

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$15.152

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$14.354

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269

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$14.354

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One Stop Electronics

USA . 255 parts In-Stock

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$398.000

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Corphita

USA . 1,078 parts In-Stock

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1,078

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Kepictronics

USA . 134 parts In-Stock

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Overview

Elevate your network connectivity with the TNETE2201BPHDG4 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. As a leading player in the Network Interfaces category, this product offers exceptional value and benefits to customers seeking reliable and high-performance solutions. Whether you're looking to enhance your telecom infrastructure or improve data transfer speeds, this Ethernet transceiver is the perfect choice. Trust Texas Instruments for quality, innovation, and unmatched performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for portable or rugged networking solutions.

No. of Terminals: 64

Having 64 terminals provides a high degree of connectivity options, allowing for versatile networking configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand heat and perform reliably in various environments.

Data Rate: 1250 Mbps

The high data rate of 1250 Mbps ensures fast and efficient data transmission, making this product suitable for high-speed networking applications.

Technical Specifications

Network Interfaces TNETE2201BPHDG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TNETE2201BPHDG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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