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TNETE2201BPJDG4

Texas Instruments

TNETE2201BPJDG4 by Texas Instruments

TNETE2201BPJDG4 by Texas Instruments is an Ethernet transceiver with 1250 Mbps data rate, operating at 3.3V. It features a quad-terminal position, Gull Wing terminal form, and CMOS technology. Ideal for network interfaces in commercial-grade applications due to its compact square package design and low supply current of 0.26 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,433 parts In-Stock

1+ parts

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6,433

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Digiode

USA . 530 parts In-Stock

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530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 434 parts In-Stock

1+ parts

$7.170

100+ parts

$665.828

1k+ parts

$6.453

10k+ parts

-

434

$7.170

$665.828

$6.453

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DigiPath Technology Company

USA . 1,612 parts In-Stock

1+ parts

$7.895

100+ parts

$7.263

1k+ parts

-

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1,612

$7.895

$7.263

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ChromeModa Solutions

Germany . 3,026 parts In-Stock

1+ parts

$8.056

100+ parts

$6.606

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3,026

$8.056

$6.606

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IDEA Electronic Components Group

UK . 1,527 parts In-Stock

1+ parts

$8.056

100+ parts

-

1k+ parts

$7.250

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1,527

$8.056

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$7.250

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Advanced Electronics

New Zealand . 222 parts In-Stock

1+ parts

$11.331

100+ parts

$11.218

1k+ parts

$10.764

10k+ parts

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222

$11.331

$11.218

$10.764

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AZTECH Wire

Italy . 598 parts In-Stock

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$17.744

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598

$17.744

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Semicontronic

India . 1,541 parts In-Stock

1+ parts

$805.000

100+ parts

$784.875

1k+ parts

$780.850

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1,541

$805.000

$784.875

$780.850

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One Stop Electronics

USA . 477 parts In-Stock

1+ parts

$827.000

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477

$827.000

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Corphita

USA . 2,746 parts In-Stock

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2,746

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Corohmni

South Africa . 423 parts In-Stock

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423

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Overview

Unlock seamless connectivity and unparalleled performance with the TNETE2201BPJDG4 by Texas Instruments. Crafted with precision and expertise, this network interface device boasts reliability and quality like no other. Perfect for a range of applications, this product offers unmatched value and benefits to customers seeking top-notch networking solutions. Experience the power of cutting-edge technology and elevate your connectivity experience with the TNETE2201BPJDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the network interface, ensuring long-lasting performance.

Surface Mount: YES

Surface mounting allows for easy and secure installation on a circuit board, saving space and simplifying assembly.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and efficient data transmission.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this network interface can withstand high temperatures and perform reliably in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in a wide range of climatic conditions.

Data Rate: 1250 Mbps

With a high data rate of 1250 Mbps, this network interface enables fast and efficient data transfer, ideal for high-performance networking applications.

Technical Specifications

Network Interfaces TNETE2201BPJDG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TNETE2201BPJDG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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