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TNETE211PN

Texas Instruments

TNETE211PN by Texas Instruments

TNETE211PN by Texas Instruments is a Network Interface IC with 80 terminals in a square package. Operating temperature range of 0-70°C, CMOS technology, and 5V supply voltage make it ideal for telecom interface circuits. Its low profile flatpack design with gull wing terminals suits commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,644 parts In-Stock

1+ parts

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5,644

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Digiode

USA . 1,885 parts In-Stock

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1,885

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Lantek

USA . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

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$7.455

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677

$7.455

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Parana Technologies

USA . 2,342 parts In-Stock

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$8.532

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$9.191

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2,342

$8.532

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$9.191

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ChromeModa Solutions

Germany . 3,525 parts In-Stock

1+ parts

$9.587

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$7.861

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3,525

$9.587

$7.861

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IDEA Electronic Components Group

UK . 75 parts In-Stock

1+ parts

$9.587

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$9.108

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$8.628

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75

$9.587

$9.108

$8.628

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One Stop Electronics

USA . 499 parts In-Stock

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$784.000

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499

$784.000

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Corphita

USA . 4,400 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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DigiPath Technology Company

USA . 1,493 parts In-Stock

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$8.644

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1,493

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$8.644

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Kepictronics

USA . 630 parts In-Stock

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630

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GreenTree Electronics

Israel . 150 parts In-Stock

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150

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Overview

Elevate your network connectivity with the TNETE211PN from Texas Instruments, a leading manufacturer known for its superior quality and reliability. This network interface device offers seamless integration and high performance, making it ideal for a wide range of applications. Say goodbye to connectivity issues and experience smooth data transmission with this innovative product. Upgrade your network infrastructure today and see the difference that Texas Instruments can make for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the product is lightweight and durable, making it ideal for use in various applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during assembly.

No. of Terminals: 80

With 80 terminals, this product offers a high level of connectivity for different devices and systems, providing ample options for integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to function reliably even in challenging environmental conditions, increasing its overall durability.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high performance, making this network interface efficient and reliable in operation.

Technical Specifications

Network Interfaces TNETE211PN attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TNETE211PN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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