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TMX5703137APGEQQ1

Texas Instruments

TMX5703137APGEQQ1 by Texas Instruments

TMX5703137APGEQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family. It features 16-bit address and external data bus width, 262144 bytes of RAM, and 3145728 ROM words. Suitable for industrial applications, it operates b/w -40 to 105 °C with a max clock frequency of 80 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,077 parts In-Stock

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4,077

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Vyrian

USA . 915 parts In-Stock

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915

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Distributors (Availability)

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AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$14.382

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716

$14.382

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One Stop Electronics

USA . 1,536 parts In-Stock

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$19.000

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1,536

$19.000

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Parana Technologies

USA . 1,138 parts In-Stock

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$46.243

100+ parts

$4,294.329

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$41.618

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1,138

$46.243

$4,294.329

$41.618

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DigiPath Technology Company

USA . 1,150 parts In-Stock

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$50.919

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$46.845

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1,150

$50.919

$46.845

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ChromeModa Solutions

Germany . 4,877 parts In-Stock

1+ parts

$51.958

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$42.606

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4,877

$51.958

$42.606

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IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$51.958

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$49.360

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$46.762

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2,232

$51.958

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$46.762

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Corphita

USA . 2,566 parts In-Stock

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Microchip USA

USA . 177 parts In-Stock

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Overview

Elevate your projects with the TMX5703137APGEQQ1 microcontroller from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments provides cutting-edge technology that meets the needs of various applications. This microcontroller offers unparalleled value with its high-performance capabilities and versatile features. Whether you're working on automotive systems, industrial controls, or consumer electronics, this product delivers exceptional benefits and advantages to help you bring your ideas to life. Upgrade your designs with the TMX5703137APGEQQ1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Address Bus Width: 16

With a wider address bus width, the microcontroller can access a larger memory space, enabling more complex functions and applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this microcontroller suitable for automotive and industrial applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB and easy placement in compact designs.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for demanding applications.

Power Supplies (V): 1.2,3.3,3.3/5

Multiple power supply options provide flexibility in design and compatibility with various voltage requirements in different systems.

No. of Terminals: 144

High number of terminals allow for more connectivity options and interface capabilities with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer design flexibility and compatibility with different assembly processes and PCB layouts.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage enhances power efficiency and allows for operation in low-power environments.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliability and performance in extended temperature environments.

CPU Family: CORTEX-R4F

CORTEX-R4F CPU family offers high performance and efficiency for real-time processing in embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in harsh environmental conditions and ensures reliable performance in extreme temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity and reliability for long-term operation.

ADC Channels: YES

Built-in ADC channels allow for analog input processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels enable efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and assembly, making the microcontroller suitable for compact designs.

ROM Words: 3145728

Large ROM memory capacity allows for storing complex algorithms and program code, enabling versatile functionality.

Maximum Seated Height: 1.6 mm

Low seated height enables the microcontroller to be used in slim and compact devices with limited space availability.

Width: 20 mm

Compact width dimension allows for efficient PCB layout and placement in space-constrained designs.

External Data Bus Width: 16

Wide external data bus width allows for high-speed data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing and real-time operation for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time duration ensures reliable soldering and assembly of the microcontroller.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections and long-term reliability of the microcontroller.

Length: 20 mm

Compact length dimension allows for efficient PCB layout and placement in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation and performance in rugged industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller with various peripheral ICs provides versatile functionality for a wide range of applications.

RAM Bytes: 262144

Large RAM memory capacity allows for efficient data storage and processing, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and reliable electrical contacts for long-term operation.

Maximum Supply Current: 400 mA

Maximum supply current rating ensures sufficient power delivery for the microcontroller's operation in various applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller across different voltage levels.

PWM Channels: YES

Built-in PWM channels enable precise control of the microcontroller's output signals, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of the microcontroller's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB layout for compact designs and efficient use of space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring proper handling and storage of the microcontroller during assembly and operation.

Speed: 160 rpm

High-speed operation at 160 rpm allows for fast data processing and quick response times in real-time applications.

No. of I/O Lines: 44

44 I/O lines provide ample connectivity and interfacing options for the microcontroller, enabling versatile application possibilities.

Technical Specifications

Microcontrollers TMX5703137APGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMX5703137APGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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