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TMX5702125BPGEQQ1

Texas Instruments

TMX5702125BPGEQQ1 by Texas Instruments

TMX5702125BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family. It features 22-bit address bus, 32-bit external data bus width, and operates at max frequency of 80 MHz. Ideal for automotive applications due to AEC-Q100 screening level and low profile flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,584 parts In-Stock

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Digiode

USA . 1,848 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 529 parts In-Stock

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$16.617

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529

$16.617

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One Stop Electronics

USA . 949 parts In-Stock

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$17.000

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949

$17.000

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Ampacity Inc.

Singapore . 1,160 parts In-Stock

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$18.000

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$18.000

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Semicontronic

India . 335 parts In-Stock

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$29.000

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$28.275

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$28.130

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335

$29.000

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$28.130

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Parana Technologies

USA . 1,129 parts In-Stock

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$66.214

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DigiPath Technology Company

USA . 1,269 parts In-Stock

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$72.910

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$67.077

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$72.910

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ChromeModa Solutions

Germany . 5,135 parts In-Stock

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$74.398

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$61.006

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IDEA Electronic Components Group

UK . 655 parts In-Stock

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$74.398

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$70.678

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$66.958

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655

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Corphita

USA . 1,371 parts In-Stock

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Microchip USA

USA . 459 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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Overview

Experience the next level of innovation with the TMX5702125BPGEQQ1 microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the automotive industry. This microcontroller offers high performance and efficiency, making it ideal for a wide range of applications. From automotive systems to industrial automation, this product guarantees optimal functionality and seamless integration. Trust Texas Instruments to provide you with the best-in-class microcontrollers that will exceed your expectations and drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller is easy to install on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage requirement ensures energy efficiency and prevents potential damage from high voltage inputs.

Address Bus Width: 22

A wide address bus width of 22 allows for larger memory addressing capabilities, enabling more complex operations and data storage.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening ensures high reliability and durability, making this microcontroller suitable for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact design, optimizing space utilization in electronic devices.

Bit Size: 32

With a bit size of 32, this microcontroller can process data in 32-bit chunks, providing faster and more efficient operation.

Power Supplies (V): 1.2

The nominal supply voltage of 1.2V ensures compatibility with standard power sources, making integration easier in various systems.

No. of Terminals: 144

The high number of terminals allows for multiple connections and interfaces, enabling versatile functionality and connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a space-saving solution for compact electronic designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage requirement ensures reliable operation even in low-power scenarios, increasing the versatility of this microcontroller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand elevated temperatures, making it suitable for industrial and automotive environments.

CPU Family: CORTEX-R4F

Based on the Cortex-R4F architecture, this microcontroller offers high performance and real-time processing capabilities, making it ideal for critical applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions, enhancing the product's durability.

ADC Channels: YES

With ADC channels, this microcontroller can interface with analog sensors and signals, expanding its applicability in diverse systems.

DMA Channels: YES

Support for DMA channels enables efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, enhancing the reliability of the microcontroller in various applications.

ROM Words: 2097152

With a large ROM capacity of 2,097,152 words, this microcontroller can store extensive program instructions and data, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for slim device designs, making this microcontroller suitable for compact electronic products.

Width: 20 mm

With a width of 20mm, this microcontroller can fit into tight spaces while still offering powerful processing capabilities.

External Data Bus Width: 32

The wide external data bus width of 32 bits allows for fast data transfer between the microcontroller and external devices, enhancing system performance.

Maximum Clock Frequency: 80 MHz

With a maximum clock frequency of 80 MHz, this microcontroller can execute instructions at high speeds, ensuring swift operation in demanding applications.

Length: 20 mm

The compact length of 20mm makes this microcontroller suitable for small form factor devices while still delivering robust computing capabilities.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent temperature and performance requirements, ensuring reliable operation in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, this product offers simplified instruction sets and efficient processing, making it ideal for a wide range of applications.

RAM Bytes: 196608

With a generous RAM capacity of 196,608 bytes, this microcontroller can store and process significant amounts of data, enhancing its versatility and performance.

Technology: CMOS

Utilizing CMOS technology, this microcontroller combines high performance with low power consumption, making it energy-efficient and suitable for portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, ensuring reliable electrical connections in various operating conditions.

Maximum Supply Current: 350 mA

With a maximum supply current of 350mA, this microcontroller operates efficiently within the specified power limits, ensuring stable performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures consistent power delivery, reducing the risk of voltage fluctuations that could affect the microcontroller's operation.

PWM Channels: YES

Support for PWM channels enables precise control of output signals, making this microcontroller suitable for applications that require accurate voltage modulation.

ROM Programmability: FLASH

Featuring flash ROM programmability, this microcontroller allows for easy and flexible firmware updates, enhancing usability and adaptability.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers a high-density layout for compact circuit board designs, maximizing space efficiency.

Speed: 160 rpm

Operating at a speed of 160 rotations per minute, this microcontroller can handle rapid data processing and communication tasks, ensuring efficient performance.

Technical Specifications

Microcontrollers TMX5702125BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMX5702125BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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