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TMS5701115CPGEQQ1

Texas Instruments

TMS5701115CPGEQQ1 by Texas Instruments

TMS5701115CPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words and 128 RAM words. Ideal for automotive applications, it features 24-Ch 12-Bit ADCs, 16 DMA channels, and operates at a max frequency of 80 MHz.

Median Price

$15.559

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 650 parts In-Stock

1+ parts

$15.559

100+ parts

$13.591

1k+ parts

$9.373

10k+ parts

-

650

$15.559

$13.591

$9.373

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,590 parts In-Stock

1+ parts

$14.781

100+ parts

-

1k+ parts

-

10k+ parts

-

4,590

$14.781

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Vyrian

USA . 3,189 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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3,189

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$9.840

100+ parts

-

1k+ parts

-

10k+ parts

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65

$9.840

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-

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Corphita

USA . 3,449 parts In-Stock

1+ parts

$14.003

100+ parts

-

1k+ parts

-

10k+ parts

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3,449

$14.003

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-

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Parana Technologies

USA . 23 parts In-Stock

1+ parts

$23.241

100+ parts

$2,158.239

1k+ parts

$20.917

10k+ parts

-

23

$23.241

$2,158.239

$20.917

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DigiPath Technology Company

USA . 612 parts In-Stock

1+ parts

$25.591

100+ parts

$23.543

1k+ parts

-

10k+ parts

-

612

$25.591

$23.543

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$26.113

100+ parts

$24.807

1k+ parts

$23.502

10k+ parts

-

1,914

$26.113

$24.807

$23.502

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ChromeModa Solutions

Germany . 1,708 parts In-Stock

1+ parts

$26.113

100+ parts

$21.413

1k+ parts

-

10k+ parts

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1,708

$26.113

$21.413

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$53.231

100+ parts

$48.440

1k+ parts

$43.649

10k+ parts

-

300

$53.231

$48.440

$43.649

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

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2,700

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Overview

Experience the superior performance and reliability of the TMS5701115CPGEQQ1 microcontroller by Texas Instruments. Designed with cutting-edge technology, this device offers unparalleled quality and precision for a wide range of automotive applications. Benefit from its advanced features, low power consumption, and high-speed connectivity options, making it the ideal choice for your next project. Trust in Texas Instruments to deliver innovative solutions that exceed expectations and drive success in your designs. Elevate your creations with the TMS5701115CPGEQQ1 and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Ease of assembly and space-saving on PCBs.

Maximum Supply Voltage: 1.32 V

Support for high supply voltage applications.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage.

Package Shape: SQUARE

Optimal use of PCB space and easy integration into designs.

No. of Terminals: 144

Provides ample connectivity options for various peripherals and external components.

Bit Size: 32

Supports processing of larger data chunks efficiently.

Minimum Supply Voltage: 1.14 V

Allows operation even in low voltage scenarios.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive applications.

CPU Family: CORTEX-R4F

A powerful and efficient processing unit for high-performance applications.

ADC Channels: YES

Enables accurate analog to digital conversions for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 1048576

Ample storage for program instructions and data.

RAM Words: 128

Sufficient memory for data storage and processing during operation.

Data EEPROM Size: 64K

Allows for non-volatile data storage for critical information.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for optimized performance.

No. of Timers: 40

Allows for precise timing control of various operations and tasks.

Technology: CMOS

Low power consumption and high noise immunity.

Analog To Digital Convertors: 24-Ch 12-Bit

High-resolution ADCs for accurate analog signal conversion.

PWM Channels: YES

Facilitates precise control of analog devices through pulse-width modulation.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Versatile communication interfaces for interfacing with external devices and networks.

Technical Specifications

Microcontrollers TMS5701115CPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

40

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

465 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

CAP(6), CRC(2), DMA(16), QEP(2), POR, PWM(14), TIMER(40)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701115CPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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