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TMS5703137CGWTQEP

Texas Instruments

TMS5703137CGWTQEP by Texas Instruments

TMS5703137CGWTQEP by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 80 MHz. It features 256 words of RAM, 64K data EEPROM size, and connectivity options such as CAN, LIN, SCI, SPI, and UART. This microcontroller is commonly used in automotive applications due to its temperature grade and low power mode capabilities.

Median Price

$66.056

Lifecycle Status

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Texas Instruments

USA . 687 parts In-Stock

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$50.801

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$45.156

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Mouser Electronics

USA . 115 parts In-Stock

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$60.200

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Bristol Electronics

USA . 320 parts In-Stock

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$38.733

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$31.373

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Digiode

USA . 244 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Chip Stock

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Parana Technologies

USA . 2,330 parts In-Stock

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$30.753

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$69.358

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$30.753

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 6,075 parts In-Stock

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$28.334

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IDEA Electronic Components Group

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$34.554

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$32.826

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$31.099

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Semicontronic

India . 240 parts In-Stock

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$43.180

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$42.100

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$41.885

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$43.180

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$41.885

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Ampacity Inc.

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Continental Prestige Electronics

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Microchip USA

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Lixinc

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Argo Parts USA

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Bastille Electronics

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Perfect Parts

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Overview

Experience the power and reliability of the TMS5703137CGWTQEP microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. This microcontroller is perfect for a range of applications, offering impressive connectivity options with CAN, LIN, SCI, SPI, and UART interfaces. With its low power mode and advanced features like PWM channels and analog to digital converters, this microcontroller provides exceptional performance while optimizing energy consumption. Trust Texas Instruments for your microcontroller needs and unlock the true potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient integration of this microcontroller into electronic devices and PCBs.

Maximum Supply Voltage: 1.32 V

With a maximum supply voltage of 1.32 V, this microcontroller ensures efficient and reliable operation within a safe voltage range.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width enables efficient data processing and storage, enhancing the performance of the microcontroller.

Address Bus Width: 22

The 22-bit address bus width allows for a large memory address space, accommodating complex programs and extensive data storage.

Package Shape: SQUARE

The square package shape offers a compact form factor for easy integration and space-saving designs.

Bit Size: 32

The 32-bit architecture of this microcontroller enables high-speed processing and supports larger data sizes, enhancing overall performance.

Power Supplies (V): 1.2,3.3

The dual power supply options of 1.2V and 3.3V provide flexibility and compatibility with various power sources and voltage requirements.

No. of Terminals: 337

With 337 terminals, this microcontroller offers a wide range of I/O options, facilitating connectivity with peripheral devices and external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides improved interconnect reliability and efficient use of board space.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage requirement of 1.14V ensures the microcontroller can operate reliably even with lower power sources.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125°C allows for reliable performance and durability in high-temperature environments.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers advanced processing capabilities and real-time performance, making this microcontroller suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability, making it easy to assemble and solder this microcontroller onto a PCB.

ADC Channels: YES

With ADC channels, this microcontroller can interface with analog sensors and convert real-world signals into digital data for processing.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer between peripherals and memory, reducing the workload on the CPU.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and enables efficient heat dissipation in certain applications.

ROM Words: 3145728

With 3145728 ROM words, this microcontroller offers ample storage space for program code, enabling the implementation of complex functionalities.

Maximum Seated Height: 1.4 mm

The maximum seated height of 1.4mm ensures compatibility with slim and compact device designs, allowing for versatile integration.

RAM Words: 256

The 256 RAM words provide sufficient memory for data storage and temporary variable usage, facilitating efficient program execution and multitasking.

Width: 16 mm

The compact width of 16mm allows for easy placement and integration of this microcontroller in space-constrained designs.

Data EEPROM Size: 64K

The 64K data EEPROM size allows for non-volatile storage of critical data, preserving information even during power loss or system restarts.

Boundary Scan: YES

The presence of boundary scan capability enables efficient testing and debugging of the microcontroller, simplifying the development and troubleshooting process.

External Data Bus Width: 32

The external data bus width of 32 bits enables fast and efficient data transfer between the microcontroller and external memory devices.

Peripherals: DMA(16), TIMER(51), WDT

This microcontroller offers a range of peripherals, including 16 DMA channels, 51 timers, and a watchdog timer, enhancing its versatility and functionality.

Maximum Clock Frequency: 80 MHz

The maximum clock frequency of 80 MHz allows for high-speed processing and execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 20

With a maximum time of 20 seconds at peak reflow temperature, this microcontroller can withstand the soldering process without compromising its performance or reliability.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C ensures proper soldering and component attachment during the manufacturing process.

Length: 16 mm

The compact length of 16mm allows for space-efficient integration of this microcontroller in various electronic devices and systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the temperature and reliability requirements of automotive systems.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller is based on the RISC architecture, providing efficient instruction execution and control for a wide range of applications.

No. of Timers: 51

With 51 timers, this microcontroller offers extensive timing and event capture capabilities, enabling precise timing control in various applications.

RAM Bytes: 262144

The 262144 RAM bytes provide ample memory for data storage and efficient program execution, facilitating multitasking and data-intensive applications.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption, high noise immunity, and compatibility with modern electronic systems.

Terminal Form: BALL

The ball terminal form simplifies the soldering and mounting process, ensuring reliable electrical connections and secure mechanical attachment.

Analog To Digital Convertors: 24-Ch 12-Bit, 12-Ch 16-Bit

With 24 channels of 12-bit ADC and 12 channels of 16-bit ADC, this microcontroller can accurately convert analog signals into digital data, suitable for precise measurement and sensor applications.

Maximum Supply Current: 440 mA

The maximum supply current of 440mA ensures sufficient power for the microcontroller to operate all its components and peripherals reliably.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures compatibility with typical low-power electronic systems and reduces power consumption for efficient operation.

No. of DMA Channels: 16

With 16 DMA channels, this microcontroller allows for efficient data transfer and management, reducing CPU overhead and improving overall system performance.

No. of Serial I/Os: 11

The 11 serial I/Os provide ample connectivity options for communication with other devices, enabling integration with a wide range of peripherals and external components.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, making this microcontroller suitable for applications that require precise modulation or control.

Connectivity: CAN(2), LIN, SCI, SPI(3), UART

This microcontroller offers a range of connectivity options, including 2 CAN interfaces, LIN, SCI, 3 SPI interfaces, and UART, enabling seamless integration with various communication protocols and devices.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible and convenient updating of the microcontroller's firmware, ensuring future-proofing and easy maintenance.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm provides efficient PCB routing and compatibility with industry-standard manufacturing processes.

Format: FLOATING POINT

The floating-point format enables precise and efficient handling of decimal numbers, making this microcontroller suitable for applications that require high-precision calculations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller has a moderate sensitivity to moisture, requiring standard handling and storage precautions to maintain its reliability.

Speed: 180 rpm

With a speed of 180 revolutions per minute, this microcontroller is suitable for applications that require precise rotational control or monitoring.

Low Power Mode: YES

The low power mode capability allows for power-efficient operation when the microcontroller is idle or in standby mode, prolonging battery life and reducing energy consumption.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits enables efficient storage and execution of program instructions, optimizing the microcontroller's performance.

No. of I/O Lines: 144

With 144 I/O lines, this microcontroller offers extensive connectivity options for interfacing with external devices and components, providing versatility in system integration.

Technical Specifications

Microcontrollers TMS5703137CGWTQEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V I/O SUPPLY

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

144

No. of Serial I/Os:

11

No. of Terminals:

337

No. of Timers:

51

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

RAM Bytes:

262144

RAM Words:

256

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

440 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), LIN, SCI, SPI(3), UART

Peripherals:

DMA(16), TIMER(51), WDT

Analog To Digital Convertors:

24-Ch 12-Bit, 12-Ch 16-Bit

Trade Compliance

TMS5703137CGWTQEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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