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TMS5700914APGEQQ1

Texas Instruments

TMS5700914APGEQQ1 by Texas Instruments

TMS5700914APGEQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU, 1048576 ROM words, and 131072 RAM bytes. Ideal for automotive applications, it features 24-Ch 12-Bit ADCs, PWM channels, and connectivity via I2C and SPI interfaces. Operating temperature ranges from -40 to 125 °C.

Median Price

$21.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,220 parts In-Stock

1+ parts

$12.692

100+ parts

$11.087

1k+ parts

$7.646

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7,220

$12.692

$11.087

$7.646

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DigiKey

USA . 191 parts In-Stock

1+ parts

$21.300

100+ parts

$15.175

1k+ parts

$13.867

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191

$21.300

$15.175

$13.867

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Mouser Electronics

USA . 155 parts In-Stock

1+ parts

$21.300

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$15.180

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$13.790

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155

$21.300

$15.180

$13.790

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Distributors (In-Stock)

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Digiode

USA . 1,375 parts In-Stock

1+ parts

$10.982

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-

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1,375

$10.982

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Nova Conductors

Japan . 500 parts In-Stock

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$13.304

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500

$13.304

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 4,510 parts In-Stock

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ComSIT USA

USA . 240 parts In-Stock

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240

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Distributors (Availability)

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Semicontronic

India . 3,610 parts In-Stock

1+ parts

$9.820

100+ parts

$9.574

1k+ parts

$9.525

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3,610

$9.820

$9.574

$9.525

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Corphita

USA . 4,117 parts In-Stock

1+ parts

$10.404

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4,117

$10.404

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$13.038

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-

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$12.516

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500

$13.038

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$12.516

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Continental Prestige Electronics

USA . 6,367 parts In-Stock

1+ parts

$13.304

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$13.038

6,367

$13.304

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$13.038

Ampacity Inc.

Singapore . 2,515 parts In-Stock

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$21.390

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2,515

$21.390

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$40.767

100+ parts

$38.729

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$38.729

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2,000

$40.767

$38.729

$38.729

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Corohmni

South Africa . 280 parts In-Stock

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$66.128

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$66.128

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Parana Technologies

USA . 1,648 parts In-Stock

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$71.796

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$71.796

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DigiPath Technology Company

USA . 1,663 parts In-Stock

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$79.057

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$72.732

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1,663

$79.057

$72.732

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IDEA Electronic Components Group

UK . 501 parts In-Stock

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$80.670

100+ parts

$76.636

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$72.603

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501

$80.670

$76.636

$72.603

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ChromeModa Solutions

Germany . 115 parts In-Stock

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$80.670

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$66.149

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115

$80.670

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Perfect Parts

USA . 1,570,663 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Lixinc

USA . 8,525 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Futuretech Components

Singapore . 730 parts In-Stock

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730

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Argo Parts USA

USA . 222 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your automotive designs with the TMS5700914APGEQQ1 by Texas Instruments, a top-tier microcontroller that exceeds industry standards. Offering advanced features like 24-Ch 12-Bit ADC channels, 64K data EEPROM size, and 41 timer peripherals, this device guarantees optimal performance and functionality. With a robust ROM of 1048576 words and a maximum clock frequency of 80 MHz, this microcontroller is perfect for automotive applications that demand high-speed processing and precision. Trust in Texas Instruments' reputation for quality and innovation, and experience the unparalleled value and benefits that the TMS5700914APGEQQ1 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the microcontroller onto a PCB, saving time and effort.

Maximum Supply Voltage: 1.32 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, adding versatility to its use.

Screening Level: AEC-Q100

Being AEC-Q100 screened ensures reliability and quality for automotive and industrial applications, making it a dependable choice.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, making it suitable for compact designs.

Bit Size: 32

This 32-bit microcontroller offers enhanced processing power and capabilities compared to lower bit sizes, making it a high-performance choice.

No. of Terminals: 144

The high number of terminals allows for a wide range of connectivity options, making it suitable for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a slim profile and fine pitch, making it ideal for space-constrained designs.

Minimum Supply Voltage: 1.14 V

With a low minimum supply voltage, this microcontroller is energy-efficient and can operate in a wide range of power conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments, making it a robust choice for industrial applications.

Technical Specifications

Microcontrollers TMS5700914APGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

I2C, SPI

Peripherals:

DMA(16), PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5700914APGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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