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TMS5700432BPZQQ1R

Texas Instruments

TMS5700432BPZQQ1R by Texas Instruments

TMS5700432BPZQQ1R by Texas Instruments is a 32-bit microcontroller with 393216 ROM words, 16K data EEPROM size, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and CAN, LIN, SCI connectivity options.

Median Price

$9.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,788 parts In-Stock

1+ parts

$6.291

100+ parts

$5.496

1k+ parts

$3.790

10k+ parts

-

8,788

$6.291

$5.496

$3.790

-

DigiKey

USA . 716 parts In-Stock

1+ parts

$12.250

100+ parts

$8.242

1k+ parts

$7.691

10k+ parts

-

716

$12.250

$8.242

$7.691

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,041 parts In-Stock

1+ parts

$5.976

100+ parts

-

1k+ parts

-

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4,041

$5.976

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.100

100+ parts

-

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300

$6.100

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Chip Stock

USA . 10,490 parts In-Stock

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10,490

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Vyrian

USA . 3,152 parts In-Stock

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3,152

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Distributors (Availability)

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Semicontronic

India . 3,327 parts In-Stock

1+ parts

$5.350

100+ parts

$5.216

1k+ parts

$5.190

10k+ parts

-

3,327

$5.350

$5.216

$5.190

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Ampacity Inc.

Singapore . 3,009 parts In-Stock

1+ parts

$5.350

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3,009

$5.350

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Corphita

USA . 2,030 parts In-Stock

1+ parts

$5.662

100+ parts

-

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2,030

$5.662

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-

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Continental Prestige Electronics

USA . 3,379 parts In-Stock

1+ parts

$6.100

100+ parts

-

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10k+ parts

$5.978

3,379

$6.100

-

-

$5.978

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.100

100+ parts

$5.978

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-

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100

$6.100

$5.978

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Component Stockers USA

USA . 2,044 parts In-Stock

1+ parts

$8.970

100+ parts

$6.700

1k+ parts

$5.080

10k+ parts

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2,044

$8.970

$6.700

$5.080

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Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$41.879

100+ parts

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1,586

$41.879

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ChromeModa Solutions

Germany . 2,681 parts In-Stock

1+ parts

$47.055

100+ parts

$38.585

1k+ parts

-

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2,681

$47.055

$38.585

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IDEA Electronic Components Group

UK . 1,348 parts In-Stock

1+ parts

$47.055

100+ parts

$44.702

1k+ parts

$42.350

10k+ parts

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1,348

$47.055

$44.702

$42.350

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$65.152

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173

$65.152

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$68.513

100+ parts

$65.087

1k+ parts

$65.087

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200

$68.513

$65.087

$65.087

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Lixinc

USA . 10,693 parts In-Stock

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10,693

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 2,502 parts In-Stock

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2,502

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DigiPath Technology Company

USA . 2,246 parts In-Stock

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$42.425

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2,246

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$42.425

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the TMS5700432BPZQQ1R by Texas Instruments, a top-tier microcontroller that exceeds industry standards. Texas Instruments is renowned for its cutting-edge technology and commitment to quality, making this microcontroller a reliable choice for automotive applications. With 32-bit processing power and an array of peripherals including ADC channels, timers, and PWM channels, the TMS5700432BPZQQ1R offers unmatched performance and versatility. Embrace the future of technology with this exceptional microcontroller, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, making the product reliable for various applications.

Surface Mount: YES

Ease of installation and space-saving design, suitable for compact electronic projects.

Maximum Supply Voltage: 1.32 V

Efficient power consumption and safe voltage operation for the microcontroller.

On Chip Data RAM Width: 8

Sufficient on-chip RAM for data processing and storage.

Package Shape: SQUARE

Uniform shape for easy handling and placement on circuit boards.

Bit Size: 32

High bit size allows for complex data processing capabilities.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low-profile design suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Allows for flexible power supply options while maintaining stable operation.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for demanding environmental conditions.

Technical Specifications

Microcontrollers TMS5700432BPZQQ1R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

45

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

145 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2), LIN, SCI, SPI(3), UART

Peripherals:

POR, TIMER(20), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS5700432BPZQQ1R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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