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TMS5703137CGWTMEP

Texas Instruments

TMS5703137CGWTMEP by Texas Instruments

TMS5703137CGWTMEP by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family, 22-bit address bus width, and 262144 bytes of RAM. It operates at up to 80 MHz clock frequency and features ADC and DMA channels for versatile applications in military-grade environments. With a compact square package style, it is suitable for high-speed data processing tasks requiring low profile components.

Median Price

$145.190

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 473 parts In-Stock

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$107.092

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$103.871

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$80.520

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$107.092

$103.871

$80.520

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Mouser Electronics

USA . 21 parts In-Stock

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$145.190

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$145.190

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DigiKey

USA . 6 parts In-Stock

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$145.210

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$145.210

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Newark

USA . 55 parts In-Stock

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55

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Digiode

USA . 1,823 parts In-Stock

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$101.737

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$101.737

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Nova Conductors

Japan . 100 parts In-Stock

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$128.840

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100

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Vyrian

USA . 5,738 parts In-Stock

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Chip Stock

USA . 469 parts In-Stock

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469

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Bristol Electronics

USA . 55 parts In-Stock

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55

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Distributors (Availability)

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AZTECH Wire

Italy . 219 parts In-Stock

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$13.495

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Corohmni

South Africa . 204 parts In-Stock

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$40.116

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Parana Technologies

USA . 1,184 parts In-Stock

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$42.997

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DigiPath Technology Company

USA . 159 parts In-Stock

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$47.345

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ChromeModa Solutions

Germany . 2,522 parts In-Stock

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$48.311

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$39.615

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$48.311

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IDEA Electronic Components Group

UK . 1,463 parts In-Stock

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$48.311

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$45.895

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$43.480

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$48.311

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$43.480

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Ampacity Inc.

Singapore . 173 parts In-Stock

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$91.030

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Semicontronic

India . 173 parts In-Stock

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$91.030

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$88.754

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$88.299

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Corphita

USA . 198 parts In-Stock

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$96.383

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Aranea Global

USA . 1,000 parts In-Stock

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$126.263

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$121.213

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$126.263

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Continental Prestige Electronics

USA . 940 parts In-Stock

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$128.840

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940

$128.840

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Advanced Electronics

New Zealand . 75 parts In-Stock

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$131.417

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Lixinc

USA . 14,960 parts In-Stock

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Argo Parts USA

USA . 4,928 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Perfect Parts

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GreenTree Electronics

Israel . 55 parts In-Stock

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Overview

Unleash the power of innovation with the TMS5703137CGWTMEP by Texas Instruments, a top-of-the-line microcontroller that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this cutting-edge microcontroller is perfect for a wide range of applications, from automotive to industrial automation. With advanced features and high-quality construction, the TMS5703137CGWTMEP offers customers exceptional value and benefits, making it the ideal choice for those seeking a superior solution for their projects. Experience the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various environments.

Maximum Supply Voltage: 1.32 V

Allows for efficient power usage while providing enough voltage for operation.

Bit Size: 32

High bit size allows for processing large amounts of data efficiently.

CPU Family: CORTEX-R4F

Advanced CPU family known for high performance and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and control of peripherals.

RAM Bytes: 262144

Large RAM size allows for smooth multitasking and data manipulation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Technical Specifications

Microcontrollers TMS5703137CGWTMEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS5703137CGWTMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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