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TMS5700914APZQQ1

Texas Instruments

TMS5700914APZQQ1 by Texas Instruments

TMS5700914APZQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU, 131072 bytes RAM, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, -40 to 125 °C operating temperature range, and I2C/SPI connectivity. Package style: FLATPACK, LOW PROFILE, FINE PITCH.

Median Price

$17.712

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1 parts In-Stock

1+ parts

$11.753

100+ parts

$10.266

1k+ parts

$7.080

10k+ parts

-

1

$11.753

$10.266

$7.080

-

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$23.670

100+ parts

$15.830

1k+ parts

$15.420

10k+ parts

-

10

$23.670

$15.830

$15.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,099 parts In-Stock

1+ parts

$11.165

100+ parts

-

1k+ parts

-

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1,099

$11.165

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$13.848

100+ parts

-

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300

$13.848

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Vyrian

USA . 3,621 parts In-Stock

1+ parts

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3,621

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 36 parts In-Stock

1+ parts

$9.990

100+ parts

-

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-

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36

$9.990

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Semicontronic

India . 36 parts In-Stock

1+ parts

$9.990

100+ parts

$9.740

1k+ parts

$9.690

10k+ parts

-

36

$9.990

$9.740

$9.690

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Corphita

USA . 4,151 parts In-Stock

1+ parts

$10.578

100+ parts

-

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4,151

$10.578

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AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$12.202

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433

$12.202

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Continental Prestige Electronics

USA . 1,348 parts In-Stock

1+ parts

$12.694

100+ parts

-

1k+ parts

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$12.441

1,348

$12.694

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-

$12.441

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$13.850

100+ parts

$13.158

1k+ parts

-

10k+ parts

$12.326

100

$13.850

$13.158

-

$12.326

Parana Technologies

USA . 2,364 parts In-Stock

1+ parts

$30.690

100+ parts

-

1k+ parts

$69.248

10k+ parts

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2,364

$30.690

-

$69.248

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DigiPath Technology Company

USA . 1,909 parts In-Stock

1+ parts

$33.793

100+ parts

$31.090

1k+ parts

-

10k+ parts

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1,909

$33.793

$31.090

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ChromeModa Solutions

Germany . 2,972 parts In-Stock

1+ parts

$34.483

100+ parts

$28.276

1k+ parts

-

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2,972

$34.483

$28.276

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IDEA Electronic Components Group

UK . 746 parts In-Stock

1+ parts

$34.483

100+ parts

$32.759

1k+ parts

$31.035

10k+ parts

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746

$34.483

$32.759

$31.035

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Corohmni

South Africa . 871 parts In-Stock

1+ parts

$79.872

100+ parts

-

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871

$79.872

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A-Z Elektronik GmbH

Germany . 6,802 parts In-Stock

1+ parts

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6,802

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Argo Parts USA

USA . 2,411 parts In-Stock

1+ parts

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2,411

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Overview

Experience the cutting-edge technology of Texas Instruments with the TMS5700914APZQQ1 microcontroller. Designed for automotive applications, this high-quality product offers unparalleled performance and reliability. With features like 24-Ch 12-Bit ADC channels, 131072 bytes of RAM, and connectivity options including I2C and SPI, this microcontroller provides endless possibilities for your projects. Trust in Texas Instruments to deliver top-notch products that will exceed your expectations. Upgrade your designs today with the TMS5700914APZQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resistance to heat and corrosion, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.32 V

With a maximum supply voltage of 1.32V, the microcontroller is efficient and reliable, ensuring stable performance within safe operating limits.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the microcontroller meets stringent automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for easy and space-efficient placement on PCBs, optimizing board layout and design.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, enabling the microcontroller to handle complex tasks and calculations with speed and precision.

No. of Terminals: 100

With 100 terminals, the microcontroller offers ample connectivity options for interfacing with external components and peripherals, enhancing its versatility and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style allows for a compact and space-saving design, ideal for applications with limited space constraints.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures that the microcontroller can operate efficiently even at low power levels, maximizing energy efficiency and performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the microcontroller can withstand high temperatures, making it suitable for industrial and automotive applications where heat resistance is crucial.

CPU Family: CORTEX-R4F

The CORTEX-R4F CPU family offers high performance and advanced features, enabling the microcontroller to handle complex tasks and real-time processing with ease and efficiency.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that the microcontroller can operate in harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections for stable performance.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately convert analog signals to digital data, allowing for precise measurements and sensor interfacing in various applications.

DMA Channels: YES

DMA channels allow for direct memory access and data transfer without CPU intervention, improving system efficiency and performance for high-speed data processing.

Terminal Position: QUAD

The quad terminal position offers easy and convenient soldering and connection options, making the microcontroller suitable for automated assembly processes and mass production.

ROM Words: 1048576

With a ROM size of 1048576 words, the microcontroller has ample memory capacity for storing program instructions and data, enabling complex applications and algorithms to be executed efficiently.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for slim and compact designs, making the microcontroller suitable for space-constrained applications where size is a critical factor.

Width: 14 mm

The 14mm width provides a compact form factor, allowing the microcontroller to be integrated into small devices and systems without sacrificing performance or functionality.

Data EEPROM Size: 64K

The 64K data EEPROM size allows for non-volatile data storage with fast read/write access, enabling user-specific configurations and settings to be retained even during power cycles.

Maximum Clock Frequency: 80 MHz

With a maximum clock frequency of 80MHz, the microcontroller can execute instructions and process data at high speeds, improving overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature (260°C) ensures reliable soldering and assembly processes, maintaining the integrity of the microcontroller during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and secure soldering of the microcontroller onto PCBs, ensuring strong and reliable electrical connections for optimal performance.

Length: 14 mm

The 14mm length provides a balanced form factor, allowing for easy integration and placement of the microcontroller in a variety of applications without compromising on performance or functionality.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the microcontroller can withstand harsh environmental conditions and temperature fluctuations, making it ideal for automotive and industrial applications that require reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance, low power consumption, and efficient code execution, making it a suitable choice for applications that require fast processing and real-time responsiveness.

RAM Bytes: 131072

With 131072 bytes of RAM, the microcontroller can store and manipulate data in real-time, facilitating fast and efficient operation of applications that require dynamic memory allocation and data processing.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for battery-powered and portable devices that require energy efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, ensuring reliable solder joints and ease of soldering during assembly, enhancing the overall robustness and reliability of the microcontroller.

Analog To Digital Convertors: 24-Ch 12-Bit

The 24-channel 12-bit ADCs allow for precise and accurate conversion of analog signals into digital data, supporting high-resolution sensor measurements and signal processing in various applications.

Nominal Supply Voltage: 1.2 V

With a nominal supply voltage of 1.2V, the microcontroller operates efficiently and reliably within standard voltage ranges, ensuring stable performance and optimal power consumption.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate precise analog output signals with varying duty cycles, making it suitable for controlling motors, actuators, and other devices that require pulse-width modulation.

Connectivity: I2C, SPI

Support for I2C and SPI communication interfaces allows the microcontroller to easily interface with a wide range of sensors, displays, and other peripherals, enhancing connectivity and compatibility with external devices.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates and memory reprogramming, enabling the microcontroller to adapt to changing requirements and application needs without the need for external programming tools.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller offers precise and compact terminal spacing, enabling high-density PCB layouts and saving valuable board space in miniaturized designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller has a moderate moisture sensitivity, requiring proper handling and storage to prevent moisture-related damage during reflow soldering and assembly processes.

Speed: 100 rpm

With a speed of 100 rpm, the microcontroller can perform fast and efficient data processing and calculations, supporting real-time applications and high-speed control tasks with minimal latency.

Technical Specifications

Microcontrollers TMS5700914APZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

I2C, SPI

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5700914APZQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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