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TMS5703137DZWTQQ1

Texas Instruments

TMS5703137DZWTQQ1 by Texas Instruments

TMS5703137DZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, suitable for automotive applications. It features 24-Ch 12-Bit ADCs, 16 DMA channels, and CAN, ETHERNET, I2C connectivity options. Operating at up to 80 MHz with low power mode support and flash ROM programmability.

Median Price

$33.960

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 52 parts In-Stock

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$12.700

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Texas Instruments

USA . 6,715 parts In-Stock

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$28.279

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$25.137

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$18.483

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Arrow

USA . 10 parts In-Stock

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$33.960

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$33.960

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Verical

USA . 10 parts In-Stock

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$33.960

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Mouser Electronics

USA . 269 parts In-Stock

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$51.830

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$38.840

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Distributors (In-Stock)

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Digiode

USA . 3,081 parts In-Stock

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$21.878

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Nova Conductors

Japan . 10 parts In-Stock

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$32.160

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Vyrian

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Chip Stock

USA . 3,839 parts In-Stock

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,165 parts In-Stock

1+ parts

$17.590

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$17.150

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$17.062

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Corphita

USA . 4,767 parts In-Stock

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$20.727

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$27.230

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$25.869

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$25.869

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Continental Prestige Electronics

USA . 366 parts In-Stock

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$29.480

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$28.891

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$28.891

Aranea Global

USA . 500 parts In-Stock

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$31.517

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$30.257

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$31.517

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Ampacity Inc.

Singapore . 773 parts In-Stock

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$38.300

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Corohmni

South Africa . 118 parts In-Stock

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$54.028

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Parana Technologies

USA . 2,227 parts In-Stock

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$76.942

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DigiPath Technology Company

USA . 635 parts In-Stock

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$84.723

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$84.723

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ChromeModa Solutions

Germany . 5,242 parts In-Stock

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$86.452

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$70.891

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IDEA Electronic Components Group

UK . 1,255 parts In-Stock

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$86.452

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$82.129

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$77.807

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Lixinc

USA . 17,721 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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A-Z Elektronik GmbH

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Technoshack Inc. (Excess)

Canada . 1,020 parts In-Stock

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Futuretech Components

Singapore . 450 parts In-Stock

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GreenTree Electronics

Israel . 270 parts In-Stock

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Argo Parts USA

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S.R.D Solutions

India . 100 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS5703137DZWTQQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers like this one, designed for automotive applications. With features like advanced peripherals, low power mode, and a wide range of connectivity options, this microcontroller offers unmatched value and benefits to customers looking for high performance and reliability. Trust Texas Instruments to provide you with the innovative solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

RAM Words: 256

Sufficient onboard RAM allows for efficient data processing and multitasking capabilities.

ADC Channels: YES

The presence of ADC channels enables analog signal processing and sensor interfacing.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature and environment conditions, making it suitable for automotive applications.

Connectivity: CAN(3), ETHERNET, I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

A wide range of connectivity options allows for versatile communication with other devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture results in efficient and fast data processing, ideal for applications requiring high performance.

Speed: 180 rpm

The high speed capability allows for quick data processing and response times in applications requiring real-time operation.

Technical Specifications

Microcontrollers TMS5703137DZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

144

No. of Serial I/Os:

11

No. of Terminals:

337

No. of Timers:

40

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Peripherals:

DMA(16), POR, TIMER(44), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5703137DZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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