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TMS5701114CZWTQQ1

Texas Instruments

TMS5701114CZWTQQ1 by Texas Instruments

TMS5701114CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words and 131072 RAM bytes. It operates at a max clock frequency of 80 MHz, suitable for automotive applications requiring high-speed processing. With 24-Ch 12-Bit ADC channels and various connectivity options like CAN, I2C, LIN, MIBSPI, SCI, and SPI, it offers versatile peripheral support.

Median Price

$25.486

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 269 parts In-Stock

1+ parts

$16.912

100+ parts

$14.773

1k+ parts

$10.188

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269

$16.912

$14.773

$10.188

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Mouser Electronics

USA . 142 parts In-Stock

1+ parts

$34.060

100+ parts

$22.750

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$21.700

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142

$34.060

$22.750

$21.700

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Distributors (In-Stock)

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Digiode

USA . 142 parts In-Stock

1+ parts

$16.066

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142

$16.066

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Nova Conductors

Japan . 1,000 parts In-Stock

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$17.720

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1,000

$17.720

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Vyrian

USA . 6,601 parts In-Stock

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6,601

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Distributors (Availability)

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$7.058

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-

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451

$7.058

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$14.380

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216

$14.380

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Semicontronic

India . 216 parts In-Stock

1+ parts

$14.380

100+ parts

$14.020

1k+ parts

$13.949

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216

$14.380

$14.020

$13.949

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Corphita

USA . 4,758 parts In-Stock

1+ parts

$15.221

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$15.221

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Corohmni

South Africa . 307 parts In-Stock

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$17.610

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$17.610

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Continental Prestige Electronics

USA . 5,448 parts In-Stock

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$17.720

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$17.366

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$17.720

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$17.366

Netroflash

USA . 1,000 parts In-Stock

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$17.720

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$17.720

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Advanced Electronics

New Zealand . 80 parts In-Stock

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$18.074

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$18.074

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$18.074

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80

$18.074

$18.074

$18.074

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Parana Technologies

USA . 2,304 parts In-Stock

1+ parts

$72.247

100+ parts

$6,709.196

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$65.022

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2,304

$72.247

$6,709.196

$65.022

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DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$79.552

100+ parts

$73.188

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456

$79.552

$73.188

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ChromeModa Solutions

Germany . 3,337 parts In-Stock

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$81.176

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$66.564

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3,337

$81.176

$66.564

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$81.176

100+ parts

$77.117

1k+ parts

$73.058

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2,255

$81.176

$77.117

$73.058

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Lixinc

USA . 19,428 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 213 parts In-Stock

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A-Z Elektronik GmbH

Germany . 180 parts In-Stock

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180

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Overview

Unlock the power of advanced technology with the TMS5701114CZWTQQ1 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device is perfect for a wide range of automotive applications. With features like high-speed processing, ample memory storage, and versatile connectivity options, this microcontroller offers unparalleled performance. Trust in Texas Instruments to deliver top-quality products that meet your needs and exceed your expectations. Upgrade your projects today with the TMS5701114CZWTQQ1 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving on production costs and space.

Maximum Supply Voltage: 1.32 V

Operating at a maximum supply voltage of 1.32V ensures compatibility with a wide range of power sources while providing efficient performance.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures reliability and quality suitable for automotive applications where stringent standards are necessary.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, especially in applications where board real estate is limited.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, allowing for faster execution of tasks and improved overall performance.

No. of Terminals: 337

Having 337 terminals offers a wide range of I/O options for connecting peripherals and external devices, making the microcontroller versatile and adaptable to different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, fine pitch package style provides high density mounting options, allowing for more components to be packed onto a smaller PCB area, ideal for compact designs.

Minimum Supply Voltage: 1.14 V

Operating at a minimum supply voltage of 1.14V allows for energy-efficient performance, making it suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

Operating at a high maximum temperature of 125°C enables the microcontroller to withstand demanding environmental conditions without compromising performance.

CPU Family: CORTEX-R4F

Utilizing the CORTEX-R4F CPU family offers high processing power and efficiency, making it suitable for real-time control applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can function reliably in harsh cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance and longevity.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling the system to interact with the real world through sensors and other analog devices.

DMA Channels: YES

DMA channels facilitate direct memory access, enabling efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Having terminals located at the bottom makes it easier to integrate into compact designs and facilitates better thermal management for improved reliability.

ROM Words: 1048576

With a large ROM capacity of 1048576 words, the microcontroller can store a significant amount of program instructions and data, ideal for complex applications.

Maximum Seated Height: 1.4 mm

With a low maximum seated height of 1.4 mm, the microcontroller can be mounted in slim devices while maintaining a compact form factor.

Width: 16 mm

The 16mm width allows for easy integration into various PCB layouts, making it compatible with a wide range of design requirements.

Data EEPROM Size: 64K

The 64K data EEPROM size provides ample non-volatile memory for storing critical data, configurations, and settings, ensuring data retention even during power loss.

Peripherals: CAP(6), CRC(2), QEP(2), POR, PWM(14), TIMER(44)

The wide range of peripherals including capacitive touch, CRC, quadrature encoders, PWM, and timers offer versatile functionality for various application requirements, enhancing the microcontroller's capabilities.

Maximum Clock Frequency: 80 MHz

Operating at a maximum clock frequency of 80 MHz provides high-speed processing capabilities, ideal for real-time control and signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can undergo reflow soldering processes efficiently and reliably.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can endure high-temperature soldering processes without damaging its components.

Length: 16 mm

With a length of 16mm, the microcontroller offers a compact form factor suitable for space-constrained applications while maintaining high performance.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures the microcontroller's reliability and durability in automotive applications, meeting the industry's strict quality and performance standards.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture in a microcontroller design provides efficient and streamlined processing, reducing power consumption while maintaining high performance.

RAM Bytes: 131072

With a large RAM capacity of 131072 bytes, the microcontroller can store and process a significant amount of data, improving system responsiveness and multitasking capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, making the microcontroller suitable for energy-efficient and compact designs.

Terminal Form: BALL

Utilizing ball terminal form facilitates reliable and robust solder connections, ensuring secure attachment to the PCB for long-term reliability and performance.

Analog To Digital Convertors: 24-Ch 12-Bit

Having 24-channel 12-bit ADCs enables the microcontroller to accurately convert analog signals into digital data with high resolution, essential for precision measurement and sensor interfacing.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2V provides a balance between performance and power efficiency, making it suitable for a wide range of applications.

PWM Channels: YES

Having PWM channels enables the generation of precise pulse-width modulation signals, crucial for controlling motors, LEDs, and other devices that require varying levels of power.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Supporting various communication interfaces such as CAN, I2C, LIN, SPI, and SCI offers flexible connectivity options for interacting with external devices and systems, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Utilizing Flash ROM allows for efficient and flexible programming of the microcontroller's memory, enabling easy updates and modifications to the firmware without requiring additional programming hardware.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, the microcontroller offers high-density mounting options, enabling compact PCB designs while maintaining reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring reliability in various environments.

Speed: 180 rpm

With a speed of 180 rpm, the microcontroller can process data and execute commands with high efficiency, suitable for applications requiring rapid response times.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows the microcontroller to efficiently access and execute program instructions, improving system performance.

No. of I/O Lines: 101

The 101 I/O lines provide ample connectivity for interfacing with external devices and peripherals, offering flexibility and expandability for diverse application requirements.

Technical Specifications

Microcontrollers TMS5701114CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

101

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Peripherals:

CAP(6), CRC(2), QEP(2), POR, PWM(14), TIMER(44)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701114CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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