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TMS38030-6GB

Texas Instruments

TMS38030-6GB by Texas Instruments

TMS38030-6GB by Texas Instruments is a MOS technology Serial Communication Controller with 100 terminals, operating at 5V. Its ceramic square package has a grid array style and operates b/w 0°C to 70°C. Ideal for commercial applications requiring reliable serial communication control in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,696 parts In-Stock

1+ parts

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4,696

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Digiode

USA . 1,591 parts In-Stock

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1,591

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$16.270

100+ parts

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371

$16.270

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One Stop Electronics

USA . 407 parts In-Stock

1+ parts

$24.000

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407

$24.000

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Parana Technologies

USA . 1,478 parts In-Stock

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$51.667

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1,478

$51.667

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DigiPath Technology Company

USA . 1,186 parts In-Stock

1+ parts

$56.892

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1,186

$56.892

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ChromeModa Solutions

Germany . 3,208 parts In-Stock

1+ parts

$58.053

100+ parts

$47.603

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3,208

$58.053

$47.603

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IDEA Electronic Components Group

UK . 305 parts In-Stock

1+ parts

$58.053

100+ parts

$55.150

1k+ parts

$52.248

10k+ parts

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305

$58.053

$55.150

$52.248

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Corphita

USA . 738 parts In-Stock

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738

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Overview

Elevate your communication systems with the TMS38030-6GB by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The TMS38030-6GB falls under the category of Serial Communication Controllers, offering seamless connectivity and data transfer for various applications. With its advanced technology and commercial-grade temperature range, this product guarantees optimal performance and efficiency. Trust Texas Instruments to deliver value and innovation in every component they produce. Elevate your communication systems with the TMS38030-6GB today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and electrical insulation, making it ideal for applications requiring heat dissipation and reliability.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards and can simplify routing of traces, contributing to a more compact design.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes integration into existing systems easier and ensures compatibility with common power sources.

No. of Terminals: 100

Having a high number of terminals provides flexibility for connecting to various other components or systems, enabling versatile applications.

Package Style: GRID ARRAY

Grid array package style offers a high terminal count in a compact form factor, facilitating space-saving designs in densely populated circuit boards.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in demanding environments without risk of overheating or component failure.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning simplifies PCB layout and assembly, ensuring proper alignment of connections and potential for automated soldering processes.

Temperature Grade: COMMERCIAL

Commercial temperature grade supports operation within typical office or indoor settings, offering a cost-effective solution for many applications.

Technology: MOS

MOS technology provides a high level of integration, low power consumption, and fast switching speeds, enhancing the performance and efficiency of the controller.

Terminal Form: PIN/PEG

Pin/peg terminals offer secure connections and ease of soldering, ensuring reliable electrical contacts and simplifying the assembly process.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with common power sources and simplifies system integration, reducing design complexity.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch allows for easy interfacing with standard sockets and connectors, offering compatibility with off-the-shelf components.

Technical Specifications

Serial Communication Controllers TMS38030-6GB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA100,10X10

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

TMS38030-6GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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