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TMS38030-8GB

Texas Instruments

TMS38030-8GB by Texas Instruments

TMS38030-8GB by Texas Instruments is a Serial Communication Controller with 100 terminals, operating at 5V. It features MOS technology, operates b/w 0-70°C, and has a package style of GRID ARRAY. Ideal for commercial applications requiring reliable serial communication control in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,585

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-

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Digiode

USA . 1,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 252 parts In-Stock

1+ parts

$13.823

100+ parts

-

1k+ parts

$14.307

10k+ parts

-

252

$13.823

-

$14.307

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IDEA Electronic Components Group

UK . 1,979 parts In-Stock

1+ parts

$15.531

100+ parts

$14.754

1k+ parts

$13.978

10k+ parts

-

1,979

$15.531

$14.754

$13.978

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ChromeModa Solutions

Germany . 1,381 parts In-Stock

1+ parts

$15.531

100+ parts

$12.735

1k+ parts

-

10k+ parts

-

1,381

$15.531

$12.735

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AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$16.328

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$16.328

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-

-

One Stop Electronics

USA . 220 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

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220

$27.000

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DigiPath Technology Company

USA . 1,863 parts In-Stock

1+ parts

-

100+ parts

$14.003

1k+ parts

-

10k+ parts

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1,863

-

$14.003

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Corphita

USA . 1,319 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,319

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Overview

Experience seamless communication with the TMS38030-8GB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that cater to various applications in the field of serial communication controllers. The TMS38030-8GB offers unparalleled value and benefits, providing customers with reliable performance and efficiency. Say goodbye to communication glitches and hello to smooth operations with this innovative product. Elevate your projects with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making the product suitable for applications requiring high temperature operation.

Package Shape: SQUARE

Square shape allows for efficient use of board space and facilitates easy PCB layout.

Power Supplies (V): 5

Operating at 5 volts provides compatibility with standard power sources and ensures reliability in various system configurations.

No. of Terminals: 100

Having a high number of terminals enables the controller to interface with numerous external devices, increasing its versatility.

Package Style: GRID ARRAY

Grid array packaging offers enhanced electrical performance and reliability, making it suitable for demanding communication applications.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature provides flexibility in deployment across a wide range of environments.

Terminal Position: PERPENDICULAR

Perpendicular terminal layout simplifies PCB assembly and enhances signal integrity by minimizing noise and interference.

Temperature Grade: COMMERCIAL

Commercial temperature grade meets the requirements of most standard applications, offering cost-effective performance.

Technology: MOS

MOS technology ensures efficient power consumption and high-speed operation, making the controller suitable for various serial communication tasks.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure connections and ease of soldering, enhancing the durability and longevity of the product.

Nominal Supply Voltage: 5 V

Maintaining a nominal supply voltage of 5 volts ensures stable operation and compatibility with common electronic components.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for easy interfacing with standard connectors and components, enhancing the product's versatility.

Technical Specifications

Serial Communication Controllers TMS38030-8GB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA100,10X10

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

TMS38030-8GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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