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TMS38030PQL-30

Texas Instruments

TMS38030PQL-30 by Texas Instruments

TMS38030PQL-30 by Texas Instruments is a Serial Communication Controller with 132 terminals, operating at 5V. It has a temperature range of 0-70°C and uses MOS technology. The package is square-shaped, made of plastic/epoxy, and surface-mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,606 parts In-Stock

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Digiode

USA . 1,249 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 605 parts In-Stock

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$17.150

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$17.150

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One Stop Electronics

USA . 548 parts In-Stock

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$31.000

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548

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Parana Technologies

USA . 1,865 parts In-Stock

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$42.830

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DigiPath Technology Company

USA . 1,125 parts In-Stock

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$47.162

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$47.162

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ChromeModa Solutions

Germany . 4,314 parts In-Stock

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$48.124

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$39.462

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4,314

$48.124

$39.462

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IDEA Electronic Components Group

UK . 810 parts In-Stock

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$48.124

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$45.718

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$43.312

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810

$48.124

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Corphita

USA . 3,979 parts In-Stock

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Overview

Unlock the power of seamless communication with the TMS38030PQL-30 by Texas Instruments. Crafted with precision and expertise, this serial communication controller offers unparalleled reliability and performance. From industrial automation to telecommunications, this versatile component is designed to elevate your projects to new heights. Trust in Texas Instruments for quality and innovation, and experience the value and benefits that this product brings to your applications. Upgrade to the TMS38030PQL-30 today and revolutionize your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it suitable for applications with limited space constraints.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 132

Having a large number of terminals allows for versatile connectivity options and supports complex communication requirements.

Package Style (Meter): FLATPACK

The flatpack package style offers efficient heat dissipation and is suitable for high-density mounting, enhancing overall performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand a wide range of temperature fluctuations, ensuring reliability in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C guarantees reliable performance even in cold conditions, making the product versatile and suitable for different applications.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and signal paths, contributing to improved signal integrity and overall performance.

Technology: MOS

Utilizing MOS technology ensures high-speed operation, low power consumption, and reliable performance, making the product ideal for demanding communication tasks.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies integration into existing systems.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting on PCBs, enabling space-saving design and efficient use of board space.

Technical Specifications

Serial Communication Controllers TMS38030PQL-30 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G132

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SQFP132,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

TMS38030PQL-30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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