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TMS380C26PQ

Texas Instruments

TMS380C26PQ by Texas Instruments

TMS380C26PQ by Texas Instruments is a Serial Communication Controller with 32-bit address and data bus width, operating at 33 MHz clock frequency. It supports data transfer rates up to 2 MBps, suitable for LAN applications requiring high-speed communication. The IC features a quad-terminal layout in a flatpack package style, ideal for surface-mount assembly in commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,659 parts In-Stock

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6,659

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Digiode

USA . 4,731 parts In-Stock

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4,731

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Distributors (Availability)

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One Stop Electronics

USA . 1,403 parts In-Stock

1+ parts

$4.000

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1,403

$4.000

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AZTECH Wire

Italy . 266 parts In-Stock

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$11.792

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266

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Parana Technologies

USA . 1,483 parts In-Stock

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$21.582

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$21.975

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1,483

$21.582

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$21.975

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ChromeModa Solutions

Germany . 3,315 parts In-Stock

1+ parts

$24.250

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$19.885

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3,315

$24.250

$19.885

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IDEA Electronic Components Group

UK . 1,403 parts In-Stock

1+ parts

$24.250

100+ parts

$23.038

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$21.825

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1,403

$24.250

$23.038

$21.825

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DigiPath Technology Company

USA . 1,419 parts In-Stock

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$21.864

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1,419

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$21.864

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Corphita

USA . 94 parts In-Stock

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Overview

Enhance your serial communication capabilities with the TMS380C26PQ by Texas Instruments. Crafted with precision and expertise, this high-quality Serial Communication Controller offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides seamless data transfer at a lightning-fast speed of 2 MBps. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TMS380C26PQ - your go-to solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and prevents damage to the components inside the package.

Surface Mount: YES

Ease of installation and compact design make this product suitable for modern electronics applications.

Maximum Supply Voltage: 5.25 V

Can handle higher voltages, providing flexibility and reliability in various operating conditions.

Address Bus Width: 32

Wide address bus width allows for efficient communication and data processing within the system.

Package Shape: SQUARE

Square shape facilitates easy mounting and aligning of the IC within the circuit board.

Power Supplies (V): 5

Operates at standard voltage levels commonly used in electronic devices, ensuring compatibility.

No. of Terminals: 132

Sufficient terminals for connecting multiple external devices and components for communication purposes.

Package Style (Meter): FLATPACK, BUMPER

The combination of flatpack and bumper style provides protection and stability for the IC package.

Minimum Supply Voltage: 4.75 V

Can operate at lower voltages, saving power and increasing efficiency in low-power scenarios.

Maximum Operating Temperature: 70 °C

Wide range of operating temperature allows for reliable performance in various environmental conditions.

Maximum Data Transfer Rate: 2 MBps

High data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without any adverse effects on performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections within the circuit.

Maximum Seated Height: 4.57 mm

Low seated height allows for compact designs and efficient use of space on the circuit board.

Width: 24.13 mm

Standard width makes it compatible with various board sizes and layouts.

External Data Bus Width: 32

Matches the address bus width for seamless data transfer and processing within the system.

Maximum Clock Frequency: 33 MHz

High clock frequency enables fast operation and data processing capabilities.

Length: 24.13 mm

Compact length ensures the IC can fit into tight spaces on the circuit board.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where reliability and performance are key factors.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Designed specifically for serial communication and LAN applications, providing optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure connections on the circuit board.

Maximum Supply Current: 220 mA

Operates at a moderate supply current level, reducing power consumption and heat generation.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with existing electronic systems and components.

Bus Compatibility: 80X8X; 68XXX

Compatible with multiple bus architectures, allowing for versatile integration into different systems.

Terminal Pitch: 0.635 mm

Fine terminal pitch enables high-density mounting and precise connections on the circuit board.

Technical Specifications

Serial Communication Controllers TMS380C26PQ attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

80X8X; 68XXX

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

2 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

24.13 mm

Trade Compliance

TMS380C26PQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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