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TMS38020JDL

Texas Instruments

TMS38020JDL by Texas Instruments

TMS38020JDL by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 5V. It features MOS technology, supports LAN communication, and has a supply current of 175mA. Ideal for commercial applications requiring serial IO control in temperatures ranging from 0 to 70°C.

Median Price

$25.313

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,700 parts In-Stock

1+ parts

-

100+ parts

$20.250

1k+ parts

$18.120

10k+ parts

$17.060

6,700

-

$20.250

$18.120

$17.060

DigiKey

USA . 6,700 parts In-Stock

1+ parts

-

100+ parts

$26.650

1k+ parts

-

10k+ parts

-

6,700

-

$26.650

-

-

Verical

USA . 5,156 parts In-Stock

1+ parts

-

100+ parts

$25.313

1k+ parts

$22.650

10k+ parts

$21.325

5,156

-

$25.313

$22.650

$21.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,803 parts In-Stock

1+ parts

$21.375

100+ parts

-

1k+ parts

-

10k+ parts

-

3,803

$21.375

-

-

-

Vyrian

USA . 3,647 parts In-Stock

1+ parts

$22.500

100+ parts

-

1k+ parts

-

10k+ parts

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3,647

$22.500

-

-

-

Q Components

USA . 210 parts In-Stock

1+ parts

-

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210

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Inland Empire Components Inc.

USA . 34 parts In-Stock

1+ parts

-

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34

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M&R Communications

USA . 9 parts In-Stock

1+ parts

-

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9

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-

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J & M Industries LLC

USA . 7 parts In-Stock

1+ parts

-

100+ parts

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7

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-

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Electronic Expediters

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

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4

-

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R&J Components

USA . 3 parts In-Stock

1+ parts

-

100+ parts

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3

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-

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2

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-

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Manoshevitz Elec. Sales

Israel . 1 parts In-Stock

1+ parts

-

100+ parts

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1

-

-

-

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Connector Distribution Corp

USA . 1 parts In-Stock

1+ parts

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1

-

-

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Right Parts Inc.

USA . 1 parts In-Stock

1+ parts

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,584 parts In-Stock

1+ parts

$20.250

100+ parts

-

1k+ parts

-

10k+ parts

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1,584

$20.250

-

-

-

Component Stockers USA

USA . 19,385 parts In-Stock

1+ parts

$22.890

100+ parts

$21.520

1k+ parts

$19.450

10k+ parts

-

19,385

$22.890

$21.520

$19.450

-

Parana Technologies

USA . 2,248 parts In-Stock

1+ parts

$26.246

100+ parts

-

1k+ parts

$26.839

10k+ parts

-

2,248

$26.246

-

$26.839

-

DigiPath Technology Company

USA . 2,250 parts In-Stock

1+ parts

$28.900

100+ parts

$26.588

1k+ parts

-

10k+ parts

-

2,250

$28.900

$26.588

-

-

ChromeModa Solutions

Germany . 5,610 parts In-Stock

1+ parts

$29.490

100+ parts

$24.182

1k+ parts

-

10k+ parts

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5,610

$29.490

$24.182

-

-

IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$29.490

100+ parts

$28.016

1k+ parts

$26.541

10k+ parts

-

489

$29.490

$28.016

$26.541

-

Microchip USA

USA . 2,591 parts In-Stock

1+ parts

$53.820

100+ parts

$52.880

1k+ parts

$52.420

10k+ parts

$51.950

2,591

$53.820

$52.880

$52.420

$51.950

A-Plus Industry Inc.

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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17

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-

Overview

Enhance your serial communication systems with the high-quality TMS38020JDL by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers reliable and efficient solutions for various applications in the field of Serial Communication Controllers. With its ceramic package body and 48 terminals, this controller ensures seamless and stable performance at temperatures ranging from 0 to 70°C. Trust in Texas Instruments for cutting-edge technology and exceptional value, as the TMS38020JDL offers superior benefits and advantages to meet your communication needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides excellent thermal conductivity and stability, making it ideal for high temperature applications.

Power Supplies (V): 5

Standard voltage supply of 5V ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and flexibility in system integration.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and stability in various operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Advanced peripheral IC type enables efficient serial communication and LAN connectivity.

Maximum Supply Current: 175 mA

Low supply current requirement helps in reducing power consumption and heat generation in the system.

Technology: MOS

MOS technology offers high performance and efficiency in signal processing and communication tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and durable connections, suitable for applications requiring robustness.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with other components and PCB designs.

Technical Specifications

Serial Communication Controllers TMS38020JDL attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

175 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS38020JDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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