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TMS38020JD

Texas Instruments

TMS38020JD by Texas Instruments

TMS38020JD by Texas Instruments is a Serial IO/Communication Controller with 48 terminals, operating at 5V. It features MOS technology, operates b/w 0-55°C, and is used in LAN applications due to its ceramic package and rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,941 parts In-Stock

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5,941

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Digiode

USA . 1,273 parts In-Stock

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1,273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,082 parts In-Stock

1+ parts

$5.000

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1,082

$5.000

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AZTECH Wire

Italy . 345 parts In-Stock

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$8.207

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345

$8.207

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Parana Technologies

USA . 567 parts In-Stock

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$44.923

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567

$44.923

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DigiPath Technology Company

USA . 1,306 parts In-Stock

1+ parts

$49.466

100+ parts

$45.508

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1,306

$49.466

$45.508

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ChromeModa Solutions

Germany . 5,605 parts In-Stock

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$50.475

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$41.390

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5,605

$50.475

$41.390

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IDEA Electronic Components Group

UK . 628 parts In-Stock

1+ parts

$50.475

100+ parts

$47.951

1k+ parts

$45.428

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628

$50.475

$47.951

$45.428

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Corphita

USA . 436 parts In-Stock

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436

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Overview

Elevate your communication solutions with the TMS38020JD from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Serial Communication Controllers that set the standard in the industry. This versatile product offers unmatched value and benefits, perfectly suited for a wide range of applications. Whether you're looking to enhance your LAN capabilities or streamline your serial IO operations, the TMS38020JD is the perfect choice for customers seeking top-notch performance and efficiency. Experience the advantage of Texas Instruments technology today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and can withstand high temperatures, making it ideal for applications where heat dissipation is important.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and the ability to interface with multiple peripherals or devices.

Maximum Operating Temperature: 55 °C

With a maximum operating temperature of 55°C, this product can perform reliably in various environmental conditions without overheating.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Being a serial IO/communication controller with LAN capabilities, this product is suitable for high-speed data transfer and network connectivity.

Technical Specifications

Serial Communication Controllers TMS38020JD attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS38020JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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