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TL16C550CIFNRG4

Texas Instruments

TL16C550CIFNRG4 by Texas Instruments

TL16C550CIFNRG4 by Texas Instruments is a Serial Communication Controller with a max data transfer rate of 0.125 MBps. It operates at a max clock frequency of 16 MHz and has an industrial temperature grade. This controller is commonly used in applications requiring asynchronous, bit communication protocols.

Median Price

$8.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 165 parts In-Stock

1+ parts

$8.750

100+ parts

$5.430

1k+ parts

$3.690

10k+ parts

-

165

$8.750

$5.430

$3.690

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$3.390

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-

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550

$3.390

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Digiode

USA . 1,135 parts In-Stock

1+ parts

$6.213

100+ parts

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1,135

$6.213

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Vyrian

USA . 3,164 parts In-Stock

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3,164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,544 parts In-Stock

1+ parts

$3.390

100+ parts

-

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2,544

$3.390

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Continental Prestige Electronics

USA . 1,648 parts In-Stock

1+ parts

$3.390

100+ parts

-

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10k+ parts

$3.322

1,648

$3.390

-

-

$3.322

Ampacity Inc.

Singapore . 342 parts In-Stock

1+ parts

$5.560

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342

$5.560

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Semicontronic

India . 110 parts In-Stock

1+ parts

$5.560

100+ parts

$5.421

1k+ parts

$5.393

10k+ parts

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110

$5.560

$5.421

$5.393

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Corphita

USA . 4,766 parts In-Stock

1+ parts

$5.886

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4,766

$5.886

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AZTECH Wire

Italy . 751 parts In-Stock

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$16.460

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751

$16.460

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Parana Technologies

USA . 236 parts In-Stock

1+ parts

$44.520

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236

$44.520

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ChromeModa Solutions

Germany . 4,349 parts In-Stock

1+ parts

$50.022

100+ parts

$41.018

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4,349

$50.022

$41.018

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$50.022

100+ parts

$47.521

1k+ parts

$45.020

10k+ parts

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2,378

$50.022

$47.521

$45.020

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DigiPath Technology Company

USA . 1,388 parts In-Stock

1+ parts

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100+ parts

$45.100

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1,388

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$45.100

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Microchip USA

USA . 1,176 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$3.322

1k+ parts

$3.221

10k+ parts

$3.153

1,000

-

$3.322

$3.221

$3.153

Overview

Discover the power of seamless communication with the TL16C550CIFNRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in every product. The TL16C550CIFNRG4 is no exception, offering a wide range of applications for serial communication controllers. With its compact design and high-speed data transfer rate, this powerful chip is the perfect solution for your communication needs. Experience the value of effortless connectivity and unlock endless possibilities with the TL16C550CIFNRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable makes installation of the product easy and suitable for compact designs.

Maximum Supply Voltage: 5.25 V

Operates efficiently within a safe voltage range to prevent damage to the device.

Address Bus Width: 3

With a wider address bus width, the product can handle more complex data addressing tasks efficiently.

Package Shape: SQUARE

The square package shape allows for easier integration into circuit boards and ensures a compact design.

Power Supplies (V): 3.3/5

Supports multiple power supply options, allowing flexibility in different system configurations.

No. of Terminals: 44

The high number of terminals provide ample connectivity options for various external components or interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient thermal performance and space-saving benefits for the product.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage requirement, the product can operate effectively even under fluctuating power conditions.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, ensuring consistent performance under varying conditions.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate allows for fast and efficient communication, ideal for data-intensive applications.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for use in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers stable connections and ease of soldering during assembly.

Maximum Seated Height: 4.57 mm

The low seated height makes the product suitable for slim and compact device designs.

Width: 16.585 mm

The moderate width allows for easy integration into standard circuit board layouts.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding/decoding method ensures accurate data transmission without signal distortion.

External Data Bus Width: 8

With an external data bus width of 8, the product can handle large volumes of data efficiently.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication protocol, offering flexibility in data transmission and retrieval.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast data processing and communication speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for an extended period, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures for soldering without damage to the product.

Length: 16.585 mm

The moderate length allows for optimal placement on circuit boards without taking up excessive space.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, making it suitable for rugged applications in industrial settings.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The product serves as a versatile and efficient serial IO/communication controller for various serial communication applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, ideal for energy-efficient devices.

Terminal Form: J BEND

The J bend terminal form provides secure connections and ease of installation on circuit boards.

Maximum Supply Current: 10 mA

Consumes low supply current for efficient power management and extended battery life in portable devices.

Nominal Supply Voltage: 5 V

Operates at a standard nominal supply voltage, ensuring compatibility with most power sources.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and reliable connections during assembly.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand moderate exposure to moisture during manufacturing and storage.

Technical Specifications

Serial Communication Controllers TL16C550CIFNRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C550CIFNRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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