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TMS38021JDL

Texas Instruments

TMS38021JDL by Texas Instruments

TMS38021JDL by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 5V. It features MOS technology, supports multiple protocols, and has a max supply current of 175mA. Ideal for commercial applications requiring reliable serial I/O communication in a ceramic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,148 parts In-Stock

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Digiode

USA . 164 parts In-Stock

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164

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AZTECH Wire

Italy . 535 parts In-Stock

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$6.311

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535

$6.311

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One Stop Electronics

USA . 982 parts In-Stock

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$21.000

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982

$21.000

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Parana Technologies

USA . 818 parts In-Stock

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$21.448

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$21.814

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818

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DigiPath Technology Company

USA . 493 parts In-Stock

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$23.617

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$21.728

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493

$23.617

$21.728

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ChromeModa Solutions

Germany . 247 parts In-Stock

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$24.099

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$19.761

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247

$24.099

$19.761

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IDEA Electronic Components Group

UK . 106 parts In-Stock

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$24.099

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$22.894

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$21.689

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106

$24.099

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$21.689

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Corphita

USA . 585 parts In-Stock

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Overview

Upgrade your serial communication systems with the TMS38021JDL by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable products that exceed industry standards. The TMS38021JDL is a versatile Serial Communication Controller suitable for a wide range of applications. From industrial automation to telecommunications, this product offers exceptional value, benefits, and advantages to customers looking for seamless and efficient communication solutions. Trust Texas Instruments to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high resistance to temperature changes, ensuring the product's reliability and durability.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with common voltage sources.

No. of Terminals: 48

Offers a high number of terminals for connecting various components and peripherals, allowing for versatile integration and communication capabilities.

Maximum Operating Temperature: 70 °C

Can operate effectively at higher temperatures, making it suitable for use in a wide range of environments and applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

Supports multiple communication protocols and interfaces, enabling seamless data exchange and compatibility with different devices and systems.

Technology: MOS

Utilizes MOS technology for efficient power consumption and high-speed data processing, enhancing overall performance and energy efficiency.

Maximum Supply Current: 175 mA

Operates at a low supply current, reducing power consumption and minimizing heat generation for improved reliability and longevity.

Technical Specifications

Serial Communication Controllers TMS38021JDL attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

175 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS38021JDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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