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TMS38030GBL-6

Texas Instruments

TMS38030GBL-6 by Texas Instruments

TMS38030GBL-6 by Texas Instruments is a MOS Serial Communication Controller with 100 terminals, operating at 0-70°C. It has a 5V supply voltage and comes in a ceramic grid array package. Ideal for commercial applications requiring reliable serial communication control.

Median Price

$28.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 6 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

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6

$28.000

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DF Sales Co.

USA . 6 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$28.000

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Vyrian

USA . 4,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,329

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-

-

-

Digiode

USA . 4,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,092

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Inland Empire Components Inc.

USA . 8 parts In-Stock

1+ parts

-

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8

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R&J Components

USA . 1 parts In-Stock

1+ parts

-

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1k+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$7.754

100+ parts

-

1k+ parts

-

10k+ parts

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631

$7.754

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One Stop Electronics

USA . 982 parts In-Stock

1+ parts

$32.000

100+ parts

-

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982

$32.000

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Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$70.625

100+ parts

-

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2,180

$70.625

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DigiPath Technology Company

USA . 1,843 parts In-Stock

1+ parts

$77.767

100+ parts

$71.546

1k+ parts

-

10k+ parts

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1,843

$77.767

$71.546

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ChromeModa Solutions

Germany . 6,548 parts In-Stock

1+ parts

$79.354

100+ parts

$65.070

1k+ parts

-

10k+ parts

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6,548

$79.354

$65.070

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IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$79.354

100+ parts

$75.386

1k+ parts

$71.419

10k+ parts

-

1,206

$79.354

$75.386

$71.419

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Corphita

USA . 2,569 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,569

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Overview

Unlock seamless communication with the TMS38030GBL-6 by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers excellence in serial communication controllers. This versatile product is perfect for a wide range of applications, offering unmatched value and benefits to customers. Experience reliable performance and easy integration with this cutting-edge technology. Elevate your projects with the TMS38030GBL-6 today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides high thermal conductivity and excellent protection against moisture and contaminants, making the product durable and reliable.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with standard power sources and allows for easy integration into various systems.

No. of Terminals: 100

Having a high number of terminals provides flexibility in connectivity options and allows for versatile applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environments and ensure reliable performance even under elevated temperatures.

Technology: MOS

MOS technology offers low power consumption and high-speed operation, making the product energy-efficient and suitable for applications requiring fast data transfer.

Technical Specifications

Serial Communication Controllers TMS38030GBL-6 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA100,10X10

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

TMS38030GBL-6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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