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SC16C754BIB80

NXP Semiconductors

SC16C754BIB80 by NXP Semiconductors

SC16C754BIB80 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage, 0.625 MBps data transfer rate, and 80 MHz clock frequency. Ideal for industrial applications requiring high-speed asynchronous communication with low power consumption in a compact package.

Median Price

$5.348

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 90 parts In-Stock

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$5.348

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Digiode

USA . 2,212 parts In-Stock

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Anansix

USA . 1,441 parts In-Stock

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Vyrian

USA . 1,054 parts In-Stock

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Chip Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,019 parts In-Stock

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$5.348

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$5.241

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$5.241

Netroflash

USA . 500 parts In-Stock

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$5.348

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$5.081

10k+ parts

$4.974

500

$5.348

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$5.081

$4.974

AZTECH Wire

Italy . 473 parts In-Stock

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$14.596

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473

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Corohmni

South Africa . 22 parts In-Stock

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$21.950

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Ampacity Inc.

Singapore . 1,074 parts In-Stock

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$22.000

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One Stop Electronics

USA . 1,123 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 2,550 parts In-Stock

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$72.800

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Lixinc

USA . 10,122 parts In-Stock

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UNI Independent Distributors

Spain . 6,493 parts In-Stock

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Corphita

USA . 4,530 parts In-Stock

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Argo Parts USA

USA . 3,206 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock seamless and reliable serial communication with the SC16C754BIB80 from NXP Semiconductors. As a leader in semiconductor technology, NXP guarantees top-notch quality and performance in every product. Ideal for a wide range of applications, this Serial Communication Controller offers unmatched value and benefits to customers looking for efficient data transfer solutions. Trust NXP to deliver cutting-edge technology that exceeds expectations, setting new standards in the industry. Choose the SC16C754BIB80 for unrivaled reliability and innovation in serial communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making the product suitable for industrial use.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into electronic systems.

Maximum Supply Voltage: 3.63 V

A higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with various systems.

Address Bus Width: 3

A wider address bus width allows for efficient communication with multiple devices or memory locations.

Package Shape: SQUARE

Square package shape enables easier handling and mounting, contributing to smoother assembly processes.

Power Supplies (V): 2.5,3.3/5

Support for multiple power supply voltages gives flexibility in system design and compatibility.

No. of Terminals: 80

Having a higher number of terminals allows for more connectivity options and functionalities in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch design enables compact and efficient PCB layout, saving space in the system.

Minimum Supply Voltage: 2.97 V

A low minimum supply voltage ensures the product can operate efficiently even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the product suitable for use in harsh environments or industrial settings.

Maximum Data Transfer Rate: 0.625 MBps

High data transfer rate enables fast communication between devices, improving overall system performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function reliably even in extreme cold conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good conductivity and solderability, ensuring secure connections in the system.

Terminal Position: QUAD

Quad terminal position offers multiple connection points, enhancing flexibility in system integration.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for a compact overall system design, especially in space-constrained applications.

Width: 12 mm

Compact width size enables easy integration into various electronic systems or PCB layouts.

External Data Bus Width: 8

Wider external data bus width allows for efficient data transfer and communication between the product and external devices.

Communication Protocol: ASYNC, BIT

The support for asynchronous communication and bit-level protocols offers versatile connectivity options across different systems.

Maximum Clock Frequency: 80 MHz

High maximum clock frequency enables fast data processing and communication speed, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product supports quick reflow processes, reducing assembly time and improving production efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder connections, reducing the risk of faulty connections or solder joints.

Length: 12 mm

Compact length size allows for easy integration into electronic systems, especially where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller makes the product suitable for managing serial communication protocols efficiently, enhancing system connectivity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation of the product.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and reliability in connecting the product to the PCB or other components.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product in various system configurations.

No. of Serial I/Os: 4

Support for multiple serial I/Os enables the product to communicate with multiple devices simultaneously, improving system connectivity.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and secure connections, enhancing reliability and performance of the product.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates the product can withstand a moderate level of moisture exposure, ensuring reliability in various environmental conditions.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and prolongs battery life in portable or low-power applications.

Technical Specifications

Serial Communication Controllers SC16C754BIB80 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V OR 5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC16C754BIB80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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