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TMS320VC5501GBE300

Texas Instruments

TMS320VC5501GBE300 by Texas Instruments

TMS320VC5501GBE300 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 20 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$11.670

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 375 parts In-Stock

1+ parts

$8.366

100+ parts

$6.821

1k+ parts

$4.547

10k+ parts

-

375

$8.366

$6.821

$4.547

-

DigiKey

USA . 126 parts In-Stock

1+ parts

$11.670

100+ parts

$8.524

1k+ parts

$7.740

10k+ parts

-

126

$11.670

$8.524

$7.740

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$11.670

100+ parts

$7.750

1k+ parts

$7.690

10k+ parts

$7.410

6

$11.670

$7.750

$7.690

$7.410

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,552 parts In-Stock

1+ parts

$7.948

100+ parts

-

1k+ parts

-

10k+ parts

-

4,552

$7.948

-

-

-

Vyrian

USA . 6,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,995

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,836 parts In-Stock

1+ parts

$7.529

100+ parts

-

1k+ parts

-

10k+ parts

-

3,836

$7.529

-

-

-

Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

$20.280

100+ parts

-

1k+ parts

$20.282

10k+ parts

-

1,026

$20.280

-

$20.282

-

DigiPath Technology Company

USA . 335 parts In-Stock

1+ parts

$22.330

100+ parts

$20.544

1k+ parts

-

10k+ parts

-

335

$22.330

$20.544

-

-

ChromeModa Solutions

Germany . 3,351 parts In-Stock

1+ parts

$22.786

100+ parts

$18.685

1k+ parts

-

10k+ parts

-

3,351

$22.786

$18.685

-

-

IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$22.786

100+ parts

$21.647

1k+ parts

$20.507

10k+ parts

-

894

$22.786

$21.647

$20.507

-

Microchip USA

USA . 2,692 parts In-Stock

1+ parts

$30.600

100+ parts

$30.170

1k+ parts

$29.950

10k+ parts

$29.730

2,692

$30.600

$30.170

$29.950

$29.730

Corohmni

South Africa . 3,078 parts In-Stock

1+ parts

$47.068

100+ parts

-

1k+ parts

-

10k+ parts

-

3,078

$47.068

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24,999

-

-

-

-

iodParts Technologies Inc.

India . 126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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126

-

-

-

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Overview

Elevate your digital signal processing capabilities with the TMS320VC5501GBE300 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers cutting-edge solutions in the category of Digital Signal Processors. This versatile chip offers integrated cache, low power mode, and multiple DMA channels, making it ideal for a wide range of applications. From industrial automation to audio processing, this DSP provides value, efficiency, and unmatched performance, giving customers a competitive edge in their projects. Upgrade to the TMS320VC5501GBE300 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good protection against physical damage and environmental factors.

Integrated Cache: YES

Having an integrated cache helps to speed up data access and processing, leading to improved performance.

Maximum Supply Voltage: 1.32 V

This high supply voltage allows for efficient power consumption while still providing enough voltage for the processor to operate effectively.

RAM Words: 16384

With a large amount of RAM words, this DSP can handle complex data processing tasks and store a significant amount of information for quick retrieval.

Maximum Clock Frequency: 20 MHz

A high maximum clock frequency allows for faster data processing and response times, making this DSP suitable for real-time applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making it an energy-efficient and reliable choice for digital signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5501GBE300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5501GBE300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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